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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s Friday, the sun is out here in Arizona, and AI is on my mind (and always in the news). So, AI seems like a good place for me to focus this week. My first recommendation for this week is an article I wrote about the e-glass (and copper foil) shortage now plaguing laminate and PCB fabricators as a result of the global market’s very heavy focus on AI-related tech, hardware products, and supporting infrastructure.

Seeing a Problem, Building a Solution: The ChipHub Story

After more than three decades in the hardware industry, Aftab Farooqi knew one thing for certain: the way companies source semiconductors and components wasn’t working as well as it could. “I spent years at companies like Google and Amazon working in semiconductor sourcing,” he explains. “We were evaluating hundreds of thousands of components, with billions of dollars in spend, but the process was still incredibly manual and inefficient.”

Road to Reliability: The Foundational Technologies of Materials in EV Reliability

EV reliability is often discussed at the vehicle or system level, but many of the most persistent failures begin at the materials level. Semiconductor devices, ceramic substrates, die attach materials, wire bonds, clips, thermal interface materials, laminates, coatings, seals, and coolants define the electrical, thermal, and mechanical limits of the hardware. Once EV architectures move toward higher voltages, switching speeds, and power density, and longer service life, those materials are pushed harder, and small weaknesses can turn into large field problems

BOOK EXCERPT: The Printed Circuit Assembler’s Guide to...Design for Test, A Practical Guide to Test and Inspection, Chapter 1

Over the last two to three decades, the electronics industry has experienced a significant transformation. Circuit card assembly (CCA) and printed circuit board (PCB) design have become highly automated and digitized, allowing for faster development and increased design reuse. Engineers can now easily build on existing, proven architectures. Despite these advancements, one key area often falls behind: test and inspection.

Five Questions With… Sydney Xiao, President, East Asia Region, Global Electronics Association

AI infrastructure is reshaping the electronics industry, shifting demand from consumer products to high-performance computing systems and driving new opportunities and challenges across the global supply chain. In this edition of “Five Questions With…,” Sydney Xiao highlights the growing importance of talent development, supply chain resilience, collaboration, and standards as companies navigate rapid technological and geopolitical change.

Key Considerations When Selecting an Aqueous Cleaning Agent

Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.

My Trip to Schneider Electric: AI, Data, and the Need for More Power

AI is pushing power infrastructure to its limits, and many of those same challenges, particularly around power delivery and heat management, parallel what the electronics industry faces in building and scaling advanced microelectronics. Yet when it comes to AI and hardware, we typically only see a small piece of the total picture. So, when Schneider Electric invited me to tour a modern AI data center still under construction, I jumped at the opportunity. This became a fascinating technical journey I’m excited to share.

MacDermid Alpha Addresses Power Module Reliability Challenges at PCIM Europe 2026

MacDermid Alpha Electronics Solutions will exhibit at PCIM Europe 2026, June 9 - 11 in Nuremberg, Germany, Booth 7-460.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s picks all seem to circle around one bigger reality: The electronics industry is rebuilding itself in real time. Whether it’s investing in workforce development, reshaping manufacturing processes, modernizing how we communicate with readers, or strengthening domestic advocacy, there’s a noticeable shift from simply reacting to challenges toward actively building long-term infrastructure.

Apprenticeship Summit Highlights Electronics Workforce ‘Puzzle’

Last week, I had the opportunity to attend the 2026 Apprenticeships for America Summit in Washington, D.C., and it was both energizing and informative to be surrounded by so many leaders working to strengthen and scale apprenticeships across the country. The summit brought together employers, intermediaries, workforce leaders, educators, policy experts, and apprenticeship advocates to discuss some of the most important topics in our field

Three Key Takeaways on Material Management From Cogiscan’s Latest White Papers

Effective material management has become increasingly critical as PCB assembly operations face mounting pressure to improve efficiency, control costs, and maintain quality in complex manufacturing environments. To help electronics manufacturers navigate these challenges, Cogiscan has contributed two complementary white papers to the I-Connect007 Industry Resource Center, offering practical strategies for improving material visibility, traceability, and production performance.

Is U.S. EMS Growth Real or Just Repositioning?

Based on survey data, U.S. EMS providers are reporting a noticeable uptick in orders, and the narrative forming around what’s driving that growth is familiar: tariffs, reshoring, and a long-awaited revival of domestic manufacturing. Some analysts even claim we’ve entered a super-cycle, a prolonged period of demand-driven economic growth that can last years to decades. But as is often the case in this industry, the reality is more nuanced.

Managing DDR4, DDR5, and HBM Supply Challenges

The global electronics industry is no stranger to supply chain disruption, yet memory devices, particularly DRAM and NAND flash, sit at the center of a uniquely persistent challenge. The situation is particularly complex because constraints are not isolated; they are occurring simultaneously across both legacy and next-generation memory technologies. From DDR4 shortages driven by supplier exits to DDR5 demand being pulled by AI infrastructure, the market is facing a perfect storm of reduced supply, shifting demand, and aggressive pricing increases. For OEMs, EMS providers, and high-reliability sectors, this is a serious operational challenge.

Memorial Day Office Closure

Memorial Day is, in my opinion, one of the most meaningful holidays observed in the United States. The holiday began as “Decoration Day,” when communities gathered to place flowers on the graves of fallen Civil War soldiers. Over time, the observance evolved into a national day of remembrance honoring all U.S. military personnel who gave their lives in service to the country. Today, Memorial Day is observed on the last Monday of May and is recognized as a federal holiday nationwide.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week in the news. I could legitimately have published another five items because there were so many meaningful topics. So, I start with attorney James Kim, who returns to update us on metals tariffs. Brian Chislea and Cody Schoener from Dow recently published a book on UV curable conformal coatings. The Taiwan Printed Circuit Association has launched a PCB-specific AI knowledge base. SEMI FlexTech is seeking proposals for advancing flexible hybrid technologies, and the Global Electronics Association has launched the Global Electronics Policy Council, unifying its advocacy voices.

An Active, Growing PCB Industry Tilts Toward High-Complexity Leaders

Recent PCB market conditions point to an industry that is active and still expanding in important segments. Demand tied to AI infrastructure, servers, high-layer-count multilayer boards, HDI, ADAS, and defense-related programs remains an important driver of the market. These segments are helping sustain momentum even as conditions in other areas remain more mixed. The result is not a uniformly rising market, but one in which enough high-value activity is flowing through to keep much of the industry on a solid footing.

How New Metals Tariffs Impact the Electronics Industry

If you work in surface mount assembly, EMS, or anywhere along the electronics supply chain, you probably think of tariffs as something that happens upstream: raw materials, bulk commodities, maybe the occasional headache with Chinese imports. Steel and aluminum tariffs? That’s someone else’s problem. Not anymore. On April 2, President Trump signed a sweeping new proclamation that fundamentally restructures how Section 232 “national security” tariffs apply to steel, aluminum, copper, and their derivative products. The changes took effect on April 6, and the ripple effects are headed straight for the electronics industry.

Omega EMS Going Where the Growth Is

When you start with a well-proven management team and a chance to start from scratch, it doesn’t take long to get well established. Omega EMS CEO Chris Alessio discusses the company's rapid 10-year growth from startup to an international electronics manufacturing organization. We find out what makes things click so well.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.

Separating Fact from Fear on the FCC ‘China Lab Ban’

Recent news headlines have suggested that the U.S. Federal Communications Commission (FCC) has “banned all testing laboratories in China and Hong Kong.” Understandably, this has created concerns around PCB testing, material approvals, UL listings, and the continued use of established test laboratories in Asia. The good news is that for most PCB, PCB material, and PCBA testing, nothing has changed. Let’s separate fact from fear.

New Courses: Advance Your Electronics Expertise in June and July

Stay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.

Road to Reliability: Engineering High Uptime EV Charging Infrastructure

The transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.

Protecting Advanced Trucking Electronics in Harsh Environments

For decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.

More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors

The energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.

I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest

The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.

When Quality Is Personal: The Human Stakes Behind Electronics Reliability

In electronics manufacturing, quality is often discussed in terms of specifications, standards, and process controls, but as industry veteran Doug Pauls reminds us, the stakes are far more human. In this conversation, Doug, a recipient of the Global Electronics Association’s Hall of Fame Award, draws on more than four decades of experience to illuminate the real-world consequences of reliability, where even a single defect can carry profound implications. He brings into sharp focus why quality isn’t just a metric, but a responsibility shared by everyone on the manufacturing floor.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

If it feels like the PCB industry is accelerating faster than ever, you’re not imagining it. From advanced materials driven by AI applications to renewed investment in domestic manufacturing—and the next generation stepping into critical roles—there’s a lot shifting at once. My selections for this week highlight where the pressure points are forming, and where the opportunities are emerging.

The Missing Connection: Wire Harness Quoting Joins the Digital Age

Walk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.

AI Reshaping the Memory Market; Effects Spreading Across Industries

Artificial Intelligence is often framed as a software story focused on algorithms and models. But beneath that narrative lies a more fundamental shift rooted in hardware. AI is not just changing what technology can do; it’s changing how the physical components behind it are produced, allocated, and priced. One of the clearest examples of this shift is now emerging in the global memory market.

EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space

Every chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?

Cleaning Is Critical

Mike Bixenman, president of Magnalytix, and his colleagues Vladimir Sitko, founder of PBT Works, and Adam Klett, PhD, director of science at KYZEN, discussed how cleaning can affect reliability, in a Professional Development Course at APEX EXPO 2026. We spoke to Mike after the session to better understand the context for the current activity in cleaning technology.

Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies

This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyuki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.

Design for Test: A New Book from The Test Connection, Inc.

Bert Horner, president of The Test Connection Inc., shares insights on designing for testability (DFT) challenges with Kelly Dack. Horner discusses the critical need for incorporating testability early in the design process and the importance of quantifiable metrics for measuring test coverage. He highlights The Test Connection's role in transferring decades of 'tribal knowledge' to emerging engineers through training and education. Look for "The Printed Circuit Assembler's Guide to... Design for Test, A Practical Guide to Test and Inspection" in the I-007eBooks library.

A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'

I-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time with… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.

An Interview With Keynote Speaker Zack Kass on the 'AI Renaissance'

Zack Kass is an AI evangelist, technologist, businessman, and the author of The Next Renaissance: AI and the Expansion of Human Potential. He was a key player in bringing open AI to market and the keynote speaker at APEX EXPO 2026. Immediately following his presentation, I brought Zack to our booth, where we had a most eye-opening conversation about both the positive and negative impacts of artificial intelligence, and going beyond what’s “impossible.”

PHOTO GALLERY: A Walk on the Lighter Side

APEX EXPO isn’t all business! To wrap up our last photo gallery, we’re sharing some of our favorites from the show—a walk on the lighter side. We’re highlighting those in-between moments: quick selfies, familiar faces reconnecting, robot dogs, booth-side laughs, and the kind of candid snapshots you only get when people are genuinely enjoying themselves. At the end of the day, it’s not just about what we do, it’s about the people we do it with.

Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe

Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.

India’s Vasantha Advanced Systems: EMS Success for 30 Years

Based in one of India’s premier manufacturing regions, Vasantha Advanced Systems is an EMS provider that has built a reputation for quality, reliability, and long-term customer partnerships, earning repeated recognition from the Indian government through its National MSME Awards. Now, with a full spectrum of capabilities spanning PCB assembly, box build, and wire harness, and a workforce of more than 500, Vasantha is expanding its presence into the U.S. market. At APEX EXPO, I met Dr. Chidambaranathan and learned how this rising global player is positioning itself to meet the evolving needs of North American customers.

New Guidance Targets Scope 3.1 Emissions Gap in Electronics Supply Chains

A new industry guidance document aimed at improving how electronics companies account for Scope 3 Category 1 (Scope 3.1) emissions marks a significant step toward more consistent and effective supply chain decarbonization. A recent webinar hosted by the Global Electronics Association and the Responsible Business Alliance (RBA) addressed a persistent challenge: Despite the material impact of Scope 3.1 emissions, fewer than half of electronics companies currently report them.

Mexico’s Wire Harness Pivot Point

Mexico is a major producer of wire harnesses, but recent U.S. economic policies and Mexico’s domestic issues have had a ripple effect on the industry. Jesus Duarte, vice president of Mexico Assembly Wire Technology and president of Expo Wire Tech, explains the issue in greater depth and how the wire harness industry should respond on its own, rather than just reflect what Tier 1s are doing.

Advanced Electronics Packaging at APEX EXPO with Matt Kelly

The first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.

Siborg LCR-Reader Professional Multimeter

Michael Obrecht showcases the LCR-Reader professional benchtop multimeter from Siborg Systems Inc. Obrecht discusses the compact, Canadian-made device that offers the functionality of expensive benchtop meters at an accessible price. He details versatile measurement capabilities, including LCR, ESR, resistance, capacitance, and advanced features like signal generation and oscilloscope mode.

Indium Faces Complex Soldering Head On

Kevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.

The Future of Reflow Soldering Is Here

Michael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.

At KYZEN, Cleaning is All About Reliability

Jason Schwartz discusses KYZEN's advanced cleaning solutions for PCB assembly with Dan Beaulieu at APEX EXPO 2026. KYZEN has a 35-year legacy in defluxing, innovative real-time process control, and commitment to ensuring electronic reliability. How KYZEN partners with manufacturers through process audits and lab testing to maintain optimal cleaning standards is part of this conversation.

From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026

Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.

PHOTO GALLERY: Putting in the Work on Standards, Professional Development

Behind every standard, innovation, and step forward in electronics are the people who show up to do the work. This week's photo gallery highlights the attendees who filled meeting rooms and classrooms throughout APEX, collaborating on standards development committees, sharing expertise, and investing in their own growth through professional development. These are the faces of progress, gathered not just to learn, but to contribute and shape what comes next.

AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.

Breaking the Manual Quoting Bottleneck in Wire Harness

Arik Vrobel has spent more than 35 years in wire harness manufacturing—starting in EL-Com, his father's shop, building it into a nationally recognized contract manufacturer, and ultimately selling to Aptiv/Winchester in 2021. But retirement didn't last long. Within months, Arik was back, not as a manufacturer this time, but as a technologist. His new company, Cableteque, is building the quoting and data automation platform he always wished existed.

SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation

The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.

Regional Electronics Growth and Initiatives with Gaurab Majumdar

Nolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.

SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game

It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.

The Next Generation of Leadership: New Student Board Member Aubrey Smith 

At APEX EXPO 2026, the next generation of industry leadership was on full display with the introduction of Aubrey Smith, the Global Electronics Association’s newest Student Board Member. She’s a third-year electrical and electronics engineering student at the University of Georgia and a first-year participant in the Emerging Engineer Program. Aubrey represents the curiosity, initiative, and openness that define tomorrow’s innovators.

Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions

Jason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.

Accelerating Electronic Supply Chains With Luminovo

Timon Ruban, founder of Luminovo, explains how his company's electronic supply chain platform is revolutionizing the quoting process for contract manufacturers, reducing BOM pricing time from days to under an hour. Learn about their AI strategy and vision for coordinating company knowledge work through supply chain data in this interview.

Frank Sommer Discusses Selective Soldering Innovations for EVs

Dan Beaulieu sits down with Frank Sommer, a selective soldering expert from Nordson Electronics Solutions, to discuss the resurgence of selective soldering driven by electric vehicle manufacturing, and the need for robust through-hole component integration. He also introduces Nordson's innovative SELECT Synchro selective soldering machine, designed for enhanced throughput and flexibility.

Future-proof Laser Depaneling for PCBs with Photonics

Bill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.

Smarter AOI: Delvitech Brings Native AI to APEX EXPO

Marcy LaRont speaks with Delvitech founder and CEO Roberto Gatti about the company’s AI-native inspection technology and its growing global presence. Gatti explains how Delvitech’s integrated hardware and neural-network–driven platform is unique in the market with unmatched flexibility for implementation across multiple lines and multiple facilities.

Technica USA and DCT Partnership Insights

This discussion features Jason Perry from Technica and David Bures from DCT Cleaning, highlighting Technica's expansion in PCB fabrication and assembly. DCT, a leader in cleaning solutions, emphasizes the renewed importance of cleaning in modern electronics due to miniaturization. Comprehensive offerings and an innovative approach to achieving optimal cleanliness is revealed.
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