-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
MacDermid Enthone Electronics Solutions to Present Papers at IPC APEX EXPO 2017
December 21, 2016 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a global electronics chemicals process supplier, will present two papers at the IPC APEX Expo 2017 being held in San Diego, California, Februrary 14-16, 2017.
As a regular contributor to focus groups and an industry leader in chemical plating technologies for the manufacture of electronic devices, MacDermid Enthone regularly attends and participates in IPC conventions. Our experts will showcase our products and key research contributions through live presentations and at our interactive booth #3909 in the IPC Expo Hall.
To meet the requirements of manufacturing ever shrinking real estate on printed circuit boards and electroncs designs, MacDermid Enthone has invested in research of alternative processes to provide metal adhesion in ultra-fine circuitry. Fei Peng, Research Project Manager, will be presenting on a “Semi-additive Process for Low Loss Build-up Material in High Frequency Signal Transmission Substrates“. See her on Tuesday, February 14, 1:30PM-3:30PM, Session S03. In the through hole metallization technology arena, copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards. To showcase expertise in this technology segment, Saminda Dharmarathna, Senior Research Chemist, will be presenting on advancements in,“High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Process“. Come see him present on Wednesday, Februrary 15, 10:30AM-12:00PM, Session S13.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us at: macdermidenthone.com/electronics
Suggested Items
Saab Receives Order for Ground-Based Air Defense from Sweden
07/01/2025 | SaabSaab has received an order from the Swedish Defense Materiel Administration (FMV) for the mobile short-range air defense solution RBS 70 NG with missiles.
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
07/01/2025 | KitronKitron has received an order valued at EUR 11 million to produce advanced military communication products destined for the European market.
The Global Electronics Association Launches Industry Leading Circularity Resource Hub, Fast-Tracking Cost-Reducing, Efficient Solutions for Manufacturers
07/01/2025 | Global Electronics AssociationToday, the Global Electronics Association – the voice of the electronics industry – launched its Circularity Resource Hub. The Hub provides a centralized home for the latest industry standards, best practices, and resources to accelerate electronics’ sustainable and circular evolution.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
07/01/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.