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MacDermid Enthone Electronics Solutions to Present Papers at IPC APEX EXPO 2017
December 21, 2016 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a global electronics chemicals process supplier, will present two papers at the IPC APEX Expo 2017 being held in San Diego, California, Februrary 14-16, 2017.
As a regular contributor to focus groups and an industry leader in chemical plating technologies for the manufacture of electronic devices, MacDermid Enthone regularly attends and participates in IPC conventions. Our experts will showcase our products and key research contributions through live presentations and at our interactive booth #3909 in the IPC Expo Hall.
To meet the requirements of manufacturing ever shrinking real estate on printed circuit boards and electroncs designs, MacDermid Enthone has invested in research of alternative processes to provide metal adhesion in ultra-fine circuitry. Fei Peng, Research Project Manager, will be presenting on a “Semi-additive Process for Low Loss Build-up Material in High Frequency Signal Transmission Substrates“. See her on Tuesday, February 14, 1:30PM-3:30PM, Session S03. In the through hole metallization technology arena, copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards. To showcase expertise in this technology segment, Saminda Dharmarathna, Senior Research Chemist, will be presenting on advancements in,“High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Process“. Come see him present on Wednesday, Februrary 15, 10:30AM-12:00PM, Session S13.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us at: macdermidenthone.com/electronics
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Brent Fischthal - Koh YoungSuggested Items
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.