Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Meyer Burger to Showcase Solder Resist Printing at IPC APEX EXPO
February 7, 2017 | Meyer BurgerEstimated reading time: 1 minute
Meyer Burger (Netherlands) is exhibiting at the IPC APEX EXPO show in San Diego, CA (February 14−16) and will present our inkjet printing equipment and technology for solder mask and printed electronics applications.
Meyer Burger invites you to visit us at booth 1125 in the Flexible and Hybrid Electronics pavilion and learn about our innovative technology and equipment for additive manufacturing based on drop-on-demand, digital inkjet printing. We will showcase:
- PCB solder resist printing
- Printed, flexible and hybrid electronics
Both are emerging technologies in the electronics manufacturing industry. We look forward to explaining to you about the benefits and technological advancements, the materials, and our production equipment.
You will also find our R&D equipment on display at the booth of Insulectro (#3733/3833).
About Meyer Burger
Meyer Burger is a leading global technology company specialising in innovative systems and processes for manufacturing of electronics. The company’s focus is on photovoltaics (solar industry) while its competencies and technologies also cover important areas of the PCB, semiconductor and the optoelectronic industries as well as other selected high-end markets based on electronics materials.
The company’s comprehensive product portfolio is complemented by a worldwide service network with spare parts, consumables, process know-how, customer support, after-sales services, training and other services. Meyer Burger is represented in Europe, Asia and North America in the respective key markets and has subsidiaries and own service centres in China, Germany, India, Japan, Korea, Malaysia, the Netherlands, Switzerland, Singapore, Taiwan and the USA. To learn more, click here.
About PiXDRO
With its PiXDRO inkjet technology, Meyer Burger is leading in the field of functional inkjet printing.
PiXDRO JETx printers are equipped with piezoelectric, drop-on-demand inkjet technology and are ready for printing conductive, dielectric, resist, adhesive and other functional materials for applications in printed and flexible electronics, PCB, OLEDs, sensors, semiconductors, MEMS, chemical machining, 3D printing, photovoltaics, life science, and optics.
The PiXDRO product offering includes JETx production equipment, research and development tools, process support, training and service and is complemented by a strong network and knowledge base in inkjet materials and head technology.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.