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TTM Celebrates Grand Opening of Denver West, Colorado
February 22, 2017 | TTM Technologies, Inc.Estimated reading time: 1 minute
TTM Technologies, Inc. celebrated the grand opening of its Denver West Building in Littleton, Colorado with government officials, customers, TTM leaders, and employees. The Denver West Building allows TTM to expand its capacity and capabilities to better support customers. The new building doubles the manufacturing floor space to 55,000 square feet, allowing for critical expansion and technology upgrades over the next two years. These changes are part of TTM's plan to create a TTM Center of Excellence for satellite manufacturing in Denver.
Participants in the Grand Opening included representatives from the US Department of Defense, Deputy Director OEDIT Michelle Hadwiger on behalf of Governor Hickenlooper, and Harris Corporation Director of Supply Chain Space & Intelligence Systems Dr. Joseph A. Packard, Ph.D. TTM attendees included Aerospace & Defense / Specialty Business Unit President Phil Titterton and Senior Vice President and General Counsel Dan Weber, along with Denver's employees. "The expansion of the Denver operations was due to increased demand and TTM is proud to financially support Denver's growth for our customers' current and future needs for satellite production," said Phil Titterton.
About TTM
TTM Technologies, Inc. is a leading global printed circuit board ("PCB") manufacturer, focusing on quick-turn and volume production of technologically advanced PCBs, backplane assemblies and electro-mechanical solutions. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market.
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Julia McCaffrey - NCAB GroupSuggested Items
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Zhen Ding Drives AI-Powered Digital Transformation
09/12/2025 | Zhen DingDriven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$ trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
Flex Named to TIME's World's Best Companies List for Third Consecutive Year
09/12/2025 | FlexFlex announced its inclusion on the TIME World's Best Companies 2025 list. This marks the third consecutive year the company was included in this prestigious ranking, which recognizes top-performing companies across the globe.
Secure Semiconductor Manufacturing Acquires Full SMT Line from Manncorp
09/11/2025 | ManncorpSecure Semiconductor Manufacturing, LLC (SSM), an American-owned company dedicated to producing secure printed wiring boards and advanced assembly solutions in the MidWest USA, today announced the acquisition of a complete surface mount technology (SMT) line from Manncorp.
GlobalLogic, Ericsson Deploy Private 5G Network at Hitachi Rail’s State-of-the-Art Digital Factory
09/11/2025 | BUSINESS WIREGlobalLogic Inc., a Hitachi Group company and leader in digital engineering, has designed and deployed a state-of-the-art 5G private network at Hitachi Rail’s most digitally advanced facility in Hagerstown, Maryland, USA.