Indium Features InFORMS Reinforced Solder Preforms at PCIM Europe 2017
December 8, 2017 | Indium CorporationEstimated reading time: Less than a minute

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, which will be held from May 16-18, 2017 in Nuremberg, Germany.
Indium is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder and a reinforcing matrix that, together, increase lateral strength and bondline co-planarity while improving thermal cycling reliability.
When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:
- 4x improved thermal cycling reliability compared to a solder preform-only approach
- 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
- Reduced voiding (
- Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment
For more information about InFORMS, visit www.indium.com/informs or see Indium Corporation at booth 7-315.
About Indium
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.