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Foxconn Makes Its CES Debut, Unveiling Diverse Automotive Electronics Solutions

01/02/2025 | Foxconn
FIH, a subsidiary of Hon Hai Technology Group (Foxconn) will make its CES debut in Las Vegas from January 7 to 10, 2025, showcasing its wide-ranging automotive electronics solutions. In response to the growing complexity and diversity of in-vehicle applications,

BAE Systems Awarded $68M in U.S. Army Contracts for Additional CATV Production

01/02/2025 | BAE Systems
BAE Systems has been awarded $68 million in contracts to produce an additional 44 Cold Weather All-Terrain Vehicles (CATV) for the U.S. Army.

Laser Photonics Propels R&D Efforts in PCB Depaneling

01/01/2025 | BUSINESS WIRE
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS Laser), announced the expansion of their Printed Circuit Board (PCB) Depaneling technology development project for the electronics market.

WiSA Technologies Inks Definitive Agreement to Acquire CompuSystems

12/30/2024 | BUSINESS WIRE
WiSA Technologies, Inc., which anticipates closing its acquisition of Datavault® intellectual property and information technology assets of privately held Data Vault Holdings Inc.® and changing its name to Datavault Inc. on or about December 31, 2024, has entered into a Definitive Agreement to acquire privately held CompuSystems, Inc. (CSI).

WiSA Technologies Inks Definitive Agreement to Acquire CompuSystems

12/27/2024 | BUSINESS WIRE
WiSA Technologies, Inc., which anticipates closing its acquisition of Datavault® intellectual property and information technology assets of privately held Data Vault Holdings Inc.® and changing its name to Datavault Inc.
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