Orbotech Presents mSAP-Enabling PCB Production Solutions for Advanced HDI at CTEX 2017

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Orbotech Ltd. is demonstrating a selection of its newest, most innovative, mass production PCB manufacturing solutions at CTEX 2017, May 17-19 in Suzhou, China.

Supporting the continuing trend among PCB manufacturers toward ultra-fine resolution printed and flex circuit boards, Orbotech will highlight its comprehensive range of pre-production, production and yield management solutions that support mSAP (modified semi-additive process), advanced HDI manufacturing, and automotive PCB applications. Among the mSAP enabling solutions to be presented are Nuvogo Fine 10 for fine resolution mass production DI (Direct Imaging), Ultra Fusion 300 for AOI (Automated Optical Inspection), which can now be further enhanced with automated 2D Metrology IPQC (In-process Quality Control), and Precise™ 800 for AOS (Automated Optical Shaping) - the only one-stop solution for opens, nicks & shorts.

The company will also showcase its new Orbotech Smart Factory solution for Industry 4.0. The solution connects with all Orbotech products, enabling real-time production analysis, bi-directional communication and data sharing, together with traceability and on-demand data analysis. In addition, Orbotech will present InCAM and InPlan, its CAM and engineering software solutions.

During CTEX, Orbotech will present two sessions at the show’s NPI (New Product Introduction) Seminar. In the first session (May 17th, 13:00-13:40), Orbotech's Pacific Senior Marketing Manager Ms. Winnie Cheng will present Orbotech's mSAP suite of solutions. The second session (May 18th, 13:00-13:40), presented by Orbotech’s Pacific Marketing Manager Mr. Terry Wang, will showcase how the company's Industry 4.0 compliant solution - Orbotech Smart Factory - helps customers throughout Asia to optimize their productivity by providing traceability tools for comprehensive monitoring.

"We see that the growing number of "super" smartphone models is creating a demand from PCB manufacturers for mSAP and advanced HDI applications,” said Mr. Hadar Himmelman, President of Orbotech Pacific. "Working continuously with our customers has resulted in Orbotech developing a comprehensive range of production solutions to meet critical needs for mSAP and advanced HDI applications. The Nuvogo Fine and the Precise 800 enable our customers to produce high quality PCBs for the most advanced applications in the market while maximize their yield and providing the best cost structures. During CTEX, we will also demonstrate Orbotech's Smart Factory solution and our 2D Metrology add-on for AOI, all of which address PCB makers' needs for traceability, measurement and automation."

Orbotech PCB production solutions to be presented at CTEX 2017 include:

Nuvogo Fine 10: Nuvogo Fine 10 is a member of Orbotech’s industry-leading Direct Imaging (DI) solutions for the mSAP, advanced HDI & FPC PCB applications. Providing total synergy between Orbotech’s state-of-the-art optics, mechanics and electronics, Nuvogo Fine offers fine resolution (L/S=10/15µm) with superior imaging quality and exceptional throughput. Nuvogo Fine incorporates Orbotech’s field-proven Large Scan Optics (LSO) Technology™, delivering unmatched high Depth-of-Focus (DoF), and imaging uniformity. It is powered by MultiWave Laser Technology™ which provides optimal patterning flexibility.

Ultra Fusion 300+ 2D Metrology: Ultra Fusion 300 is an mSAP and advanced HDI AOI solution, which is a part of the Orbotech market-leading, high performance AOI family, based on the Multi-Image Technology for superior detection and false-alarm reduction. Orbotech’s Ultra Fusion 300 can now be further enhanced with automated 2D Metrology IPQC (In-process Quality Control), enabling continuous automatic inline measurement of both top and bottom conductor widths, ensuring accurate and repeatable measurements results with fast and simple sampling and advanced traceability.

Precise 800: The groundbreaking Precise 800 is the only ‘one-stop’ Automated Optical Shaping (AOS) solution for mSAP, advanced HDI and complex multi-layer boards PCB manufacturing market, capable of shaping any kind of defects: opens, nicks & shorts, all in a single automated process. Enabling accurate, high quality 3D shaping of the most advanced PCB designs, the Precise 800 significantly increases yield by virtually eliminating PCB scrap. The Precise 800 addresses all defects including those on inner and outer layers, multiple lines, corners and pads.

Sprint 200 with Ultra-Fast Automation: The Sprint 200 Inkjet Printer with ultra-fast, superior automation is Orbotech’s mass production digital legend inkjet printing solution for PCB production. This latest addition to Orbotech’s family of high performance PCB legend inkjet printers delivers cost-effective, top quality industrial inkjet printing for a consistently accurate production of even the most complex legend designs to meet any manufacturing volume need. Operable in either automated or manual mode, this printer is an advanced, cost-effective solution for today’s and tomorrow’s PCB legend and serialization needs.

InCAM and InPlan:. InCAM and InPlan are software solutions for rigid, flex and rigid-flex PCB production. InCAM is a dedicated CAM solution that combines analysis and editing capabilities with automatic production data optimization to perform high-precision CAM tooling PCB manufacturing. InPlan is an automatic engineering system that combines sophisticated engineering know-how with state-of-the-art preproduction planning tools to design the optimal manufacturing process.

About Orbotech Ltd.

Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components.