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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Uyemura Expands US Pacific Rim Service Capacity
May 24, 2017 | UyemuraEstimated reading time: Less than a minute
Jose Alonzo Garcia is Uyemura’s new technical service engineer for a key territory that includes Northern California, Washington, and Oregon. The appointment was formalized May 8th by Uyemura Vice President Don Gudeczauskas.
Garcia’s responsibilities include process troubleshooting, line audits, chemical installations and assisting customers with root cause analysis.
Garcia holds a Bachelor of Science, Chemical Engineering from San Jose State University. Most recently, he was with Streamline Circuits, a manufacturer of rigid, rigid-flex, and multilayer PCBs, where he applied SPC principles to optimize electroplating processes. In late 2016, Garcia helped qualify a new gold bath in the company’s ENIG line. The new line was TAM-55, an advanced, low-acidity immersion gold that protects the solderability of the electroless nickel in an ENIG deposit.
Garcia has a special interest in kinetics and reactor design, FMEA, and environmental management.
For more information click here.
Suggested Items
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Uyemura Expands Engineering Team in Great Lakes Region
05/30/2025 | UyemuraAndrew Jin has joined Uyemura’s Engineering Team as Technical Service Engineer for the Midwest. Jin was formerly with Sensient Technologies, Flavors and Extracts Division, where his focus was CO2 emissions and water quality; he also did capital project work with production equipment.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Real Time with... IPC APEX EXPO 2025: Uyemura—Inside the Specialty Chemicals Market
04/03/2025 | Real Time with...IPC APEX EXPORich Depoto discusses Uyemura's focus on specialty chemicals and market trends, particularly the shift towards HDI and UHDI products. Rich highlights innovations in surface adhesion and micro etches for copper, essential for high-speed transmission.
Uyemura Announces Six Sigma Graduates
04/02/2025 | UyemuraDr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.