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SelectConnect Technologies Offers White Paper on Sensor Manufacturing Using LDS
June 19, 2017 | SelectConnect TechnologiesEstimated reading time: Less than a minute
SelectConnect Technologies has published the white paper, “Laser Direct Structuring for Sensor Manufacturing.” The white paper details how sensor technology employing laser direct structuring (LDS) results in reduced manufacturing costs, while increasing the physical strength and durability of a position sensor.
Millions of electronic components with complex geometries are manufactured each year through the use of LDS to create circuit traces directly on three-dimensional molded interconnect devices (3D-MID). In addition to position sensors, LDS is used to manufacture temperature, motion, pressure, flow and optical sensors, as well as security shields, medical devices and antennas for automotive, military/aerospace and telecommunications industries.
About SelectConnect Technologies
SelectConnect Technologies specializes in the production of three-dimensional molded interconnect devices (3D-MID), offering both laser direct structuring (LDS) and 2-shot injection capabilities. Working with LPKF since 2010, the company has produced thousands of laser direct structured components for a wide range of applications. With expertise in electroless metallization, SelectConnect also produces molded interconnect device plating to construct circuitry with the comparable function and performance of a printed circuit board.
A division of Arlington Plating Company, SelectConnect Technologies is an ISO-9001:2008 company. For more information, click here.
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