Dan’s Biz Bookshelf: ‘The Art of Going SLOW’
Happy’s Tech Talk #39: PCBs Replace Motor Windings
Punching Out: Characteristics of Successful Leaders in North American PCB and EMS Sectors
Megasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects
July 4, 2017 | Thomas Jones, Dr. David Flynn, Marc P.Y. Desmulliez and Dennis PriceEstimated reading time: 1 minute
Introduction
A printed circuit board is populated with a multitude of electro-mechanical components plus various active and passive devices such as transistors, capacitors, inductors and resistors, which enable the functionality and assembly of the PCB. Increasing the density of the components on the surface of a board enables greater functionality and use. A high-density (HD) design is desirable for technology high end applications, which include automotive, aerospace, space, defense, mobile phones, medical, networking, communications, and computer storage[1].
The current trend in PCB markets is lowtechnology, high-volume demand and is typically supplied by low-cost, large-scale facilities in Southeast Asia, such as China, India and Thailand. High-value, low-volume PCB markets are typically supplied by smaller-sized facilities in western regions such as North America and Europe, but also economically developed east
ern locations such as Japan, South Korea and Taiwan[2]. The UK PCB demand typically focuses on this latter market. Manufacturing developments bringing increased capability and cost savings to a factory in the UK would be highly desirable and enable increased market competitiveness. For more than four years, Merlin Circuit Technology Ltd (MCT), in Deeside, North Wales, has been working in collaboration with Heriot-Watt University (HWU) in Edinburgh, Scotland, on a UK government project funded by the Engineering and Physical Sciences Research Council (EPSRC), looking to improve HD PCB manufacturing capability through enhancements to the electrodeposition of copper using high frequency acoustic, applied within a copper plating bath [3,4,5]. This article outlines some of the key findings from this project.
To read the full version of this article which appeared in the June 2017 issue of The PCB Magazine.
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.