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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
September 9, 2025 | ElephantechEstimated reading time: 1 minute
Elephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan. As of August 2025, Elephantech is the first and only company selected in the GX program for the DMP phase. As part of this selection, Elephantech will receive a subsidy of approximately 2.3 billion Yen at most to support its future growth.
The initiative centers around Elephantech’s proprietary low-carbon printed circuit boards (PCBs) manufacturing solution, SustainaCircuits, which aims to establish a mass production system utilizing inkjet printing equipment as manufacturing equipment and copper nano-ink & primer as printing materials.
As PCBs account for a significant portion of the electronics sector’s GHG emissions, making their fabrication greener is essential to achieving carbon-neutral objectives. Elephatech is actively addressing this challenge by improving production efficiency and driving decarbonization across the sector through the adoption of SustainaCircuits at PCB manufacturing facilities.
Building on its novel SustainaCircuits technology, Elephantech has been mass-producing flexible printed circuits in-house and supplying them to major electronics manufacturers. Following the successful development of a general-purpose multilayer PCB in 2024, the company is now expanding beyond in-house production to offer turnkey manufacturing solutions to PCB manufacturers, accelerating broader implementation of SustainaCircuits technology. Going forward Elephantech will continue advancing environmentally responsible growth of the electronics industry through sustainable and innovative technologies.
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Brent Fischthal - Koh YoungSuggested Items
Elephantech Secures Mitsubishi Electric Investment to Boost SustainaCircuits Globally
03/12/2026 | ElephantechElephantech Inc. announced a strategic partnership with Mitsubishi Electric Corporation. As part of the agreement, Mitsubishi Electric will invest JPY 4 billion in Elephantech’s Series F financing.
Elephantech to Exhibit at Semicon Japan 2025
11/28/2025 | ElephantechFrom December 17–19, Elephantech will be exhibiting at Semicon Japan 2025 at Tokyo Big Sight.
Elephantech to Showcase Thick-Copper FPC and Ultra-Fine Copper Nanofiller at AABC 2025
11/26/2025 | ElephantechElephantech will be exhibiting at AABC 2025, held from December 9-11, in Las Vegas, USA.
Voices of the Industry Features Elephantech’s Satoshi Konagai on the Future of Sustainable PCB Manufacturing
11/19/2025 | I-Connect007I-Connect007 is pleased to announce the release of the latest episode in its acclaimed podcast series, Voices of the Industry. In this episode, host Marcy LaRont speaks with Satoshi Konagai, Executive Officer and Head of Marketing of Elephantech, about the company’s groundbreaking additive manufacturing technology that’s reshaping the printed circuit board (PCB) industry.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.