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Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU

05/03/2024 | PRNewswire
Synopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.

Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis

05/03/2024 | Altair
Altair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.

Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director

05/02/2024 | Real Time with...IPC APEX EXPO
Peter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.

Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products

05/01/2024 | Real Time with...IPC APEX EXPO
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.

IPC's Vision for Empowering PCB Design Engineers

04/30/2024 | Robert Erickson, IPC
As architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
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