Internet of Things Integration Market Global Forecast to 2022
July 12, 2017 | PRNewswireEstimated reading time: 3 minutes
The IoT integration market is expected to grow at a Compound Annual Growth Rate (CAGR) of 34.2% during the forecast period due to the growth of the Bring Your Own Device (BYOD) trend, need for remote workplace management, and maturing partner agreements between IoT vendors.
The global IoT integration market size is expected to grow from USD 759.5 million in 2017 to USD 3,301.7 million by 2022, at a CAGR of 34.2%. IoT integration are transforming into the core aspects of IoT ecosystems to enable secure end-to-end communication between devices and datacenters, remote troubleshooting of components, interoperability across subsystems, and advanced business analytics and metrics. IoT integration offer new business propositions that benefit internal and external stakeholders, channel partners, and customers. This drives the need for reliable IoT integration for proper integration, monitoring, and management of the increasing number of smart devices.
The system design and architecture services segment is expected to grow at the highest CAGR during the forecast period.
System design and architecture services provide improved system performance, offer tailored configuration advice, and monitor the capability usage of system resources. System design and architecture services involve the analysis, design, and configuration of the software components required to support the system architecture. Being an integral part of integration, system design and architecture services support the implementation of IoT software and solutions in enterprise IoT ecosystems.
The large enterprises segment is expected to have the largest market size in the IoT integration market during the forecast period.
Large enterprises use IoT integration to ensure efficient integration and management of IoT devices for business processes. Large enterprises are the early adopters of IoT integration due to the presence of underlying technology infrastructure, increasing smart devices, and rising capital investments. In addition to this, large enterprises are investing in reliable IoT integration to streamline business operations, enhance stakeholder experience, and serve dynamic customer needs.
North America is expected to have the largest market size, and Asia Pacific (APAC) is projected to grow at the highest rate during the forecast period.
North America is expected to hold the largest market share in the IoT integration market during the forecast period. The critical need for reliable integration to ensure interoperability between heterogeneous smart devices and the rise in the use of advanced communication technologies, such as ZigBee, 6LoWPAN, and NFC, are the factors driving the growth of the IoT integration market in North America. The rise in the use of IoT devices across various application areas is another factor driving the growth of the North American IoT integration market.
The APAC market is expected to witness significant growth and is projected to be the fastest-growing region in the IoT integration market. APAC has emerged as the most lucrative market for IoT integration. Countries in the APAC region across various industry verticals are increasingly adopting IoT integration. The region has a competitive advantage over other regions due to the availability of local cost-efficient solutions, easy accessibility to trained labors, and flexible regulations and policies. Additionally, APAC countries are undertaking aggressive initiatives to improve IoT infrastructure, thereby enabling commercial users to adopt cutting-edge IoT technologies, solutions, and associated services.
In the process of determining and verifying the market size of several segments and subsegments gathered through secondary research, extensive primary interviews were conducted with key people. The break-up of the profiles of the primary participants is as follows:
- By Company: Tier 1 – 30 %, Tier 2 – 40%, and Tier 3 – 30%
- By Designation: C-Level – 72%, Director Level – 14%, and Others – 14%
- By Region: North America – 57%, Europe – 14%, APAC – 29%
The IoT integration market includes various major vendors such as TCS (India), Wipro (India), Capgemini (France), Infosys (India), HCL Technologies (India), Atos SE (France), Allerin (US), MuleSoft (US), Meshed (Australia), and Phitomas (Malaysia).
About Reportlinker
ReportLinker is an award-winning market research solution. Reportlinker finds and organizes the latest industry data so you get all the market research you need - instantly, in one place.
Suggested Items
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies
04/03/2025 | I-Connect007 Editorial TeamDuring the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon.
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
04/03/2025 | PRNewswireAnsys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.