Prague PEDC: Call for Abstracts Deadline July 31
July 16, 2025 | Pan-European Electronics Design Conference (PEDC)Estimated reading time: 1 minute

The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31.
Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The inaugural PEDC event was held in Vienna, Austria, in January, and the show is now set to become an annual European event. The conference features two days of lectures, keynote speeches, and networking opportunities. All PEDC presentations are peer-reviewed and non-promotional, much like the technical content at APEX EXPO in the U.S.
“The first PEDC conference in January was a resounding success, with participants from 15 European countries and five countries around the world enjoying the high-quality presentations, which were free from commercialism,” said Peter Tranitz, senior director of technology solutions for Global Electronics Association. “Our panel of technical experts will ensure that the second PEDC conference maintains this high standard. We look forward to continuing this exceptional networking event for the pan-European electronics design community and beyond.”
A presentation at the PEDC is a great way to reach your European customers. The PEDC is aimed at professionals from industry, research, and development in the field of electronics design. Show organizers Global Electronics Association and FED represent more than 3,700 companies in the electronics industry. Companies and institutions are invited to submit abstracts for technical and scientific presentations on the following topics:
- Silicon to Systems
- Design for Excellence (DfX)
- Design Software and Tools
- Sustainable Designs and Product Life Cycle
A presentation at the PEDC offers companies the opportunity to position themselves as innovation leaders and expand their network within the European electronics community. Submit your abstract today and join your colleagues in Prague next January.
Location: NH Prague City Hotel
Dates: Jan. 21-22, 2026.
Submission deadline: July 31, 2025
Further information and submission portal: www.pedc.eu.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.