Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Trouble in Your Tank: Can You Drill the Perfect Hole?
It’s Only Common Sense: Your Guide to Better Time Management
Merlin Circuit Technology Invests in Schmoll MDI
July 19, 2017 | Merlin Circuit TechnologyEstimated reading time: 1 minute
Merlin Circuit Technology, part of the Merlin PCB Group, has purchased and installed the Schmoll MDI for direct imaging primary layer patterns and solder mask, using various masks and ink types.
The Schmoll MDI uses field-proven UV-LED technology that combines a multiple wavelength system and precise registration accuracy. The MDI provides Merlin with a flexible imaging system to increase overall productivity that will enhance the production of high-technology printed circuit boards required by our end-customers in the aerospace, defence, medical and industrial sectors.
The MDI eliminates film related defects such as scratches & dirt particles, and increases accuracy with the use of dynamic linear motors mounted on a granite base. The compact foot print & easy to use operator interface enables the MDI to fit seamlessly into Merlin’s already impressive manufacturing facility. Additionally with the dynamic depth of focus used on the MDI we are able to process panels with high topography demands seen on high layer boards containing exotic materials.
This major investment shows Merlin PCB Group's commitment to the UK electronics industry and its rigid PCB plant based in North Wales, and it continues its partnership between Schmoll and Merlin PCB Group, which has been a highly valued customer since 1995.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.