Nolan's Notes: The Next Killer App in Component Manufacturing
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
Metcal HTD Tips Help Avoid Component and PCB Damage
July 20, 2017 | MetcalEstimated reading time: 1 minute
Metcal has launched the new High Thermal Demand (HTD) Solution for the MX-5200 Series. The HTD hand-piece and tips transform an MX-5000 or MX-5200 series into a powerhouse for applications with high thermal loads – such as dense boards – without damaging sensitive components.
Metcal's HTD solution delivers more thermal energy, thus efficiently minimizing the risk of component or printed circuit board damage associated with leaving a soldering iron tip on the solder joint for extended periods. The system provides a boost in performance by more effectively delivering thermal energy to the most demanding loads.
The HTD Solution can meet the most demanding requirements. It reduces the risk of prolonged soldering contact and improves time to manufacture while maintaining the comfort of the sleek and ergonomic hand-piece that you're used to. Its slimmer tips allow you to meet high thermal demand needs in a smaller form factor – getting the tip into areas industrial soldering irons cannot reach.
About Metcal
Since 1982, Metcal has been the recognized technology innovator in the OEM and global electronics assembly marketplace for the automotive, aerospace, medical devices and military sectors. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications. Its products continue to set the standard for performance, reliability, flexibility, and ROI, and are available from authorized distributors in North America and around the world. For more information, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.