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Conductor Analysis Technologies (CAT) Installs OM Thermal Stress Systems at TTM-Sterling
September 6, 2017 | Conductor Analysis TechnologiesEstimated reading time: Less than a minute
Conductor Analysis Technologies announces the installation and operation of two OM Thermal Stress Systems at TTM’s Sterling, Virginia manufacturing facility.
Tim Estes, CAT Chief Technology Officer, and Nick Meeker, CAT Chief Operating Officer, were personally at the Sterling site to oversee the installation and provided training. The systems perform both convection reflow assembly simulation of the recently released IPC-TM-650, Method 2.7.27A and air-to-air thermal cycling of IPCTM-650, Method 2.6.7.2.
About Conductor Analysis Technologies, Inc.
Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, purchasers, assemblers, and manufacturers of printed circuit boards. Founded in 1994, our products and services provide a standardized, independent, and documented evaluation of printed manufacturing capability, quality, and reliability. For more information, click here.
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