Harris Wins $133 Million US Navy and Australian F/A-18 Electronic Warfare Contract
October 17, 2017 | Business WireEstimated reading time: 1 minute
Harris Corporation has received a $133 million contract to supply electronic jammers to protect U.S. Navy and Australian F/A-18 Hornet and Super Hornet aircraft against electronic threats. The contract was awarded during the first quarter of Harris' fiscal 2018.
Under the contract, Harris will manufacture and deliver ALQ-214(V)4/5 Integrated Defensive Electronic Countermeasures (IDECM) jammers for the F/A-18C/D/E/F variants. The ALQ-214(V)4/5 is the key onboard electronic warfare jamming system for the IDECM program and protects the aircraft from sophisticated electronic threats, including modern integrated air defense systems.
Deliveries to the U.S. Navy and to Australia through the U.S. government’s Foreign Military Sales program are expected to be complete by May 2020.
“Naval aviators face a growing range of threats as their missions evolve and hostile actors gain access to increasingly advanced technology,” said Ed Zoiss, president, Harris Electronic Systems. “Harris has helped keep naval aviators ahead of emerging threats for nearly 20 years. We remain firmly committed to supporting their critical missions.”
About Harris Corporation
Harris Corporation is a leading technology innovator, solving customers’ toughest mission-critical challenges by providing solutions that connect, inform and protect. Harris supports government and commercial customers in more than 100 countries and has approximately $6 billion in annual revenue. The company is organized into three business segments: Communication Systems, Electronic Systems and Space and Intelligence Systems.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Circus SE Set for High-Volume Market Entry in the Defense Sector
10/17/2025 | BUSINESS WIRECircus SE a global technology leader in AI robotics for autonomous nutrition systems and troop supply, is expanding its global production network as part of its high-volume market entry into the defense sector.
China Expands Rare Earth Export Restrictions, Tightening Grip on Global Supply Chains
10/16/2025 | I-Connect007 Editorial TeamChina sharply expanded its rare earth export restrictions on Oct. 9, adding additional elements and refining technologies to its control list while imposing stricter rules on foreign users in the defense and semiconductor industries.
SAMI Advanced Electronics Company Launches “Remal” Computer Manufacturing Project in Partnership with HP and Foxconn
10/15/2025 | SAMI-AECSAMI Advanced Electronics Company (SAMI-AEC), a wholly owned subsidiary of Saudi Arabian Military Industries (SAMI), proudly announced the launch of the “Remal” project for computer manufacturing, in strategic partnership with HP and Foxconn.
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
10/15/2025 | Steve Williams -- Column: The Right ApproachThere is no bronze bust in the lobby or portrait in the conference room of Electro-Tek's founder—my Dad, Charles “Chuck” Williams—so with the facility closing last year after 56 years, I feel it is time to tell the story. Chuck Williams founded Electro-Tek in 1968 in our basement, eventually moving into the second floor of an old 1913 building in downtown Milwaukee that is still standing (the first of three eventual facilities).
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.