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Suggested Items

New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect

08/21/2025 | I-Connect007
In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.

SEL: Revolutionizing PCB Production Through MES, Partnerships, and Vision

08/21/2025 | Barry Matties, I-Connect007
Two years ago, we visited Schweitzer Engineering Laboratories (SEL) to better understand its new captive greenfield PCB facility. We recently returned, this time to discuss how this bold vision has transformed the industry. Barry Matties met with John Hendrickson, engineering director, and Jessi Hall, vice president of vertical integration, to discuss the transformative capabilities of Factory Core, SEL’s custom manufacturing execution system (MES), which allows for real-time monitoring of workflow and machine performance, and has led to impressive improvements in quality and cost efficiency.

Inventing the Future: An Interview with Dr. Ed Schweitzer

08/20/2025 | Barry Matties, I-Connect007
Dr. Edmund O. Schweitzer III, founder of Schweitzer Engineering Laboratories (SEL), has a corner office in the company’s world headquarters in Pullman, Washington. Forty-two years after his SEL-21—the first microprocessor-based digital protective relay—ushered in a new era of power-system protection, he has forever changed the way the world safeguards its electric grids. In this three-hour conversation, Dr. Schweitzer reveals that he remains excited to get to work each day, unpacking the “better, cheaper, faster, simpler” mantra that’s still driving SEL’s innovation, and the culture glue that keeps more than 7,000 employee-owners rowing in unison.

Amphenol to Acquire Trexon

08/19/2025 | BUSINESS WIRE
Amphenol Corporation announced a definitive agreement to acquire Trexon for approximately $1 billion in cash, subject to customary post-closing adjustments.

Happy’s Tech Talk #42: Applying Density Equations to UHDI Design

08/19/2025 | Happy Holden -- Column: Happy’s Tech Talk
With the need for faster speeds, more parts on an assembly, and the trend to make things smaller for portability, the printed circuit design and layout process is both creative and challenging. The process involves “applying the density equation” while considering certain boundary conditions, such as electrical and thermal performance. Unfortunately, many designers don’t realize there is a mathematical process to laying out a printed circuit.
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