OFFSET “Sprinters” to Pursue State-of-the-art Solutions for Second Swarm Sprint
April 3, 2018 | DARPAEstimated reading time: 2 minutes

DARPA’s OFFensive Swarm-Enabled Tactics (OFFSET) program envisions future small-unit infantry forces using small unmanned aircraft systems (UASs) and/or small unmanned ground systems (UGSs) in swarms of 250 robots or more to accomplish diverse missions in complex urban environments. By leveraging and combining emerging technologies in swarm autonomy and human-swarm teaming, the program seeks to enable rapid development and deployment of breakthrough swarm capabilities.
To continue the rapid pace and further advance the technology development of OFFSET, DARPA is soliciting proposals for the second “swarm sprint.” Each of the five core “sprints” focuses on one of the key thrust areas: Swarm Tactics, Swarm Autonomy, Human-Swarm Team, Virtual Environment, and Physical Testbed. This second group of “Swarm Sprinters” will have the opportunity to work with one or both of the OFFSET Swarm Systems Integrator teams to develop and assess tactics as well as algorithms to enhance autonomy.
The focus of the second sprint is enabling improved autonomy through enhancements of platforms and/or autonomy elements, with the operational backdrop of utilizing a diverse swarm of 50 air and ground robots to isolate an urban objective within an area of two city blocks over a mission duration of 15 to 30 minutes. Swarm Sprinters will leverage existing or develop new hardware components, algorithms, and/or primitives to enable novel capabilities that specifically demonstrate the advantages of a swarm when leveraging and operating in complex urban environments.
The conclusion of the second sprint is aligned with a physical and virtual experiment, where “sprinters” will be able to more deeply integrate and demonstrate their technology developments. The sprinters will have the opportunity to work with DARPA and the Swarm Systems Integrators to further expand the capabilities relevant to operational contexts.
“As operations in urban environments continue to evolve, our warfighters need advanced capabilities to keep up with the ever-changing complexity of the urban scenario,” said Timothy Chung, program manager in DARPA’s Tactical Technology Office (TTO). “The focus on enhancing autonomy in operational contexts will further advance future swarming capabilities allowing the warfighter to outmaneuver our adversaries in these complex urban environments.”
The announcement for this second swarm sprint follows the awarding of contracts to the first cohort of OFFSET Swarm Sprinters to:
- Lockheed Martin, Advanced Technology Laboratories
- SoarTech, Inc.
- Charles River Analytics, Inc.
- University of Maryland
- Carnegie Mellon University
Each of these inaugural sprinters will focus on generating novel tactics for a multi-faceted swarm of air and ground robots in support of the mission to isolate an urban objective, such as conducting reconnaissance, generating a semantic map of the area of operations, and/or identifying and defending against possible security risks.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs:
Kopin Announces $9 Million Follow-On Contract for Defense Thermal Imaging Assembly
08/14/2025 | BUSINESS WIREKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, industrial, consumer and medical products, today announced the award of an approximate $9 million follow-on production contract in support of a custom thermal imaging assembly build for a major U.S. defense prime contractor.
Smart Automation: Pick-and-place Machines—What Matters in 2025
08/12/2025 | Josh Casper -- Column: Smart AutomationWhen people talk about placement technology, they often zero in on speed: How fast can a machine place components? What's the quoted components per hour (CPH)? How many nozzles are on the head? While these metrics matter, on most production floors, the fastest machine on paper isn’t always the most productive.
Elementary Mr. Watson: Closing the Gap Between Design and Manufacturing
07/23/2025 | John Watson -- Column: Elementary, Mr. WatsonModern PCB designers are not merely engineers or technicians. I believe that PCB design, at its core, is an art form, and modern PCB designers should be considered artists. Beyond the technical calculations and engineering rules lies a creative process that involves vision, balance, and a passion for what we do. Like any artist who works with brush and canvas or chisel and stone, a PCB designer shapes invisible pathways that bring ideas to life. Each trace, layer, and component placement reflects thoughtful decisions that blend form, fit, and function.
VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
06/09/2025 | BUSINESS WIREVeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.