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Nano Dimension to Present at Canaccord 38th Annual Growth Conference
July 19, 2018 | Globe NewswireEstimated reading time: 1 minute
Nano Dimension Ltd. announced today that Amit Dror, co-founder and chief executive officer, will present at the Canaccord 38th Annual Growth Conference in Boston, on Wednesday, August 8 at 2:30 p.m. EDT. In addition, Dror will participate in a panel discussion titled: “Emerging 3D Printing Technologies,” following the presentation. The panel will be moderated by Bobby Burleson, Managing Director, Research Analyst at Canaccord Genuity.
A live webcast of the presentation will be available here.
The webcast will be archived for 90 days following the live presentation. Mr. Dror will be available for one-on-one meetings on August 8. To schedule a meeting, please contact your Canaccord representative.
About Canaccord Genuity 38th Annual Growth Conference
For the 38th year, Canaccord Genuity will be bringing together some of the world’s most innovative companies and institutional investors at the Growth Conference. For two highly productive days, leaders in the growth universe will come together to share knowledge, discuss emerging trends, build relationships, identify opportunities and ignite global ideas for growth.
About Nano Dimension Ltd.
Nano Dimension is a leading additive manufacturing technology company. Nano Dimension is disrupting, shaping and defining the future of how electronics are made. With its unique 3D printing technologies, Nano Dimension is targeting the growing demand for electronic devices that require increasingly sophisticated features and rely on printed circuit boards (PCBs). Demand for circuitry, including PCBs - which are the heart of every electronic device - covers a diverse range of industries, including consumer electronics, medical devices, defense, aerospace, automotive, IoT and telecom. These sectors can all benefit greatly from Nano Dimension’s 3D printed electronics solutions for rapid prototyping and short-run manufacturing.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.