-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Rehm Presentation Draws Crowd at SbSTC in Wuhan
August 29, 2018 | Rehm Thermal SystemsEstimated reading time: 1 minute
Rehm Thermal Systems, the specialist for thermal system solutions, recently participated in the SbSTC New Technology Seminar in Wuhan, China. More than 300 experts from all over the country exchanged views on topics related to research and application of SMT technology.
Wang Yu, Sales Director of Rehm Region East China, was one of the presenters. His presentation on “Void-free soldering with vacuum soldering systems” with numerous case studies aroused considerable interest among the audience, which included many manufacturers of electronic components. At its info point, Rehm informed the trade visitors about the technical details and advantages of its solutions. One of the main focuses was the demonstration of the VisionXP reflow soldering system. It guarantees both flexibility and high capacity and can therefore perfectly meet the constantly growing demands.
There is a good reason for participating in events in Asia: The strong economic growth of the countries there brings with it an increasing demand from plenty of industries, including the automotive, consumer electronics, medical technology and automation sectors. This is where Rehm comes in and shows how the production of electronic assemblies can be solved in a modern and economical way.
Wang Yu drew a positive conclusion: “This seminar fully met our expectations in terms of quantity and quality of participants. In future, we will increasingly cooperate with the SbSTC Conference Group to carry out personal exchange with our customers. We will discuss various technical challenges in the industry together with our partners. Our clear goal is to make consistent progress in technological research and development and thereby ensure the continuous development of our products.”
About Rehm Thermal Systems
As a specialist in thermal system solutions for the electronics and photovoltaics industry, Rehm is a technology and innovation leader in state-of-the-art, cost-effective manufacturing of electronic assemblies. As a globally active manufacturer of reflow soldering systems with convection, condensation and vacuum, drying and coating systems, functional test systems, equipment for metallisation of solar cells as well as numerous customised systems, we have a presence in all key growth markets and, as a partner with more than 25 years of industry experience, are able to implement innovative production solutions that set new standards.
Suggested Items
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024
05/07/2024 | SEMIWorldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
Nolan’s Notes: Coming to Terms With AI
05/07/2024 | Nolan Johnson -- Column: Nolan's NotesHow fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then I went to IPC APEX EXPO and upended it all. I originally had compared AI to drag racing in that (CPU) horsepower and new (data) vehicles have steadily delivered higher performance competition. That seemed pretty accurate given how generative AI models dominated the popular media with amazing results—and sometimes spectacular crashes.
May Issue of SMT007 Magazine: Coming to Terms With AI
05/06/2024 | I-Connect007 Editorial TeamIn the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.