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MacDermid Enthone Electronics Solutions to Present at SMTAI 2018
October 1, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, will present two technical papers at the SMTA International Technical Conference. The conference will be held October 14-18, at the Donald Stephens Convention Center, Rosemont, Illinois, USA. MacDermid Enthone innovation specialists will be presenting papers on their latest research for technological advances in the electronics industry.
Both papers will be presented on Tuesday, October 16 in the SUB2: Enhanced Copper Plating Technologies sessions. At 2:00 p.m., Rogers Bernards, new product development R&D manager, will be presenting “High Elongation on Electroless Copper“, the development of a copper system for advanced metallization of substrates that undergo high stresses. Following Roger at 3:00 p.m., Saminda Dharmarathna, principal R&D chemist, will be presenting on high-denisty interconnect technology in his paper “Innovative Copper Electroplating Process For Any Layer Via Fill With Planar Via Top and Thin Surface Copper.“
Want to discuss these presentations and other technical inquiries? Stop by MacDermid Enthone/Alpha booth #1115 during the exhibition, October 16-17.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. For more information, click here.
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