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Aluminum and FR-4 PCBs for LED Lighting from Super PCB
November 12, 2018 | Super PCBEstimated reading time: 1 minute
Super PCB, a single source for high-quality printed circuit boards (PCBs), now offers aluminum and FR-4 PCBs for LED lighting. The company can produce both prototypes and mass production for LED lighting applications.
LED lighting has been one of the fastest growing industries in recent years. Compared to traditional lighting, LED lighting substantially reduces energy consumption. One of Super PCB’s specialties is aluminum and FR-4 PCBs for LED lighting. In addition to Bergquist materials, the company carries high quality equivalent aluminum materials with much lower costs.
PCBs for LED lighting applications can have unique shapes. Some are very long strips; some are circular. In lighting applications, many customers require the solder mask to be bright white for better reflection. Additionally, avoiding discoloration is an importnant requirement and Super PCB’s high quality white solder mask stays bright white. Super PCB has been working with one of the larget LED lighting manfufacturers in the world for years, providing a large volume of long (over 40") FR-4 PCBs for LED lighting application.
Super PCB offers USA manufacturing to support fast-turn and ITAR requirements, as well as overseas manufacturing facilities to support mass production at lower costs. The company’s manufacturing facilities are RoHS compliant, ISO 9001 and TS16949 certified, and UL-listed. Super PCB’s state-of-art equipment and technology ensures the highest quality and efficiency.
About Super PCB
Super PCB is the source for all of your high-quality PCB needs! Since 2003, the company has been providing high quality PCBs to numerous companies in a broad spectrum of industries, from consumer electronics to telecommunications, new energy, aerospace, automotive and more. Super PCB is certified to TS16949, ISO9001 and UL. For more information, click here.
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Brent Fischthal - Koh YoungSuggested Items
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10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.