The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
It’s Only Common Sense: Why Sales Teams Fail (and How to Fix Them)
Holst Centre and NovaCentrix Light up Flexible Electronics Integration
November 14, 2018 | Holst CentreEstimated reading time: 1 minute
Demand for high-performance multifunctional flexible systems is increasing. To deliver such systems, manufacturers need to be able to combine standard silicon ICs or surface mounted device (SMD) components with printed circuits on flexible plastic substrates. As chips get smaller, the density of interconnects gets higher, demanding higher-resolution interconnection technologies. Moreover, the low melting point of the plastics used in cost-effective substrates make traditional thermal techniques impossible.
The team from Holst Centre and NovaCentrix has developed photonic soldering, a light-based technique that enable fast, high-resolution integration of silicon components onto flexible foils. Photonic soldering uses intense light pulses from advanced flash lamp systems to cure the solder paste within seconds. Only the solder paste is heated, not the substrate, thus making the technology compatible with low-cost films such as PET. The technique is compatible with roll-to-roll production for cost-effective high-volume production.
"Flexible hybrid systems require reliable interconnections between the printed and standard silicon components. Our light-assisted technique offers better mechanical stability and electrical connections than existing approaches, and is the only current means for using standard lead-free solder on low-melting-point plastic films," says Francesca Chiappini, research scientist at Holst Centre.
"Using our state-of-the-art PulseForge tools, photonic soldering can cure off-the-shelf solder pastes within 5 seconds. This is ideal for combining the performance and reliability of traditional electronics with the capabilities of flexible printed systems. As the newly-installed photonic soldering pilot line at Holst Centre shows, photonic soldering is ready for commercial-scale, high-throughput manufacturing," adds Stan Farnsworth, Chief Marketing Officer at NovaCentrix.
Share on:
Suggested Items
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.