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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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MacDermid Enthone's Judy Ding Successfully Presents at Japan MID Association's Annual Symposium
November 23, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: Less than a minute

Earlier this month, the Japan MID Association held its annual symposium in Tokyo. Judy Ding, Associate Research Fellow for MacDermid Enthone, was a keynote speaker at the event and discussed "Electroless Copper Deposits Providing High Ductility and Adhesion for Advanced MID Applications". The conference included automotive industry experts from Aisin, Denso, Nissan, Toyoda Gosei and other Japanese companies. The day concluded with a 3-person panel review about global MID trends, moderated by Julian Bashore, General Manager Japan.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics—in everything you see, and in many things you don’t—MacDermid Enthone is there.
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