Top 10 Most-Read PCB007 Interviews of 2018
January 2, 2019 | I-Connect007Estimated reading time: 3 minutes

Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview done by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward. Read on!
1. In Terms of Experience, a 10,000-foot View of China
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.
2. A Plug-in that Connects CAD Software to 3D Printer
Nano Dimension's DragonFly 2020 Pro 3D Printer is a highly accurate and versatile inkjet deposition and curing system for printing professional multilayer circuit boards, structural electronics and antennas. In a sweeping discussion with Nano Dimension USA President Simon Fried, all my questions were answered about this innovative technology.
3. Cicor’s Approach to Miniaturization: Cost of Function, and More
Barry Matties spoke with Karl Heinz-Fritz, VP of technology, about Cicor’s newest product line, which can shrink the size of a circuit by up to 40%, and the importance of measuring the cost of functionality.
4. Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone
Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.
5. The Best It’s Ever Been, Every Year: The Goal for IPC, Part 1
The end of 2017 caps an exciting time for IPC and IPC China as membership has grown substantially, in part because of new offerings from the organization to its Asian members. Meeting with Barry Matties at HKPCA, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.
6. Staying Ahead of Market Trends Through Education
ESI equipment has been in high demand with the recent rise of flex and HDI. But when Barry Matties met with Patrick Riechel and John Williams at HKPCA, they explained that it is really ESI’s future protection and flexibility in the process that keeps them ahead of the market and allows for ongoing success.
7. Welcome to the Silicon Valley Neighborhood: Nano Dimension Arrives in California
I-Connect007 Technical Editor Dan Feinberg accepted an invitation recently to tour Nano Dimension’s new USA headquarters in Santa Clara’s Silicon Valley, which included a sit-down with President and Co-Founder Simon Fried.
8. Blue Sky for Eagle Electronics
I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.
9. Bridging Knowledge and Understanding of Thermal Management Materials
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
10. Riding the Tsunami of Success in Asia
Since Phil Carmichael has overseen IPC Asia, the program and its membership have grown substantially, and with good reason. Phil met with Barry Matties at HKPCA to discuss how IPC offerings such as the QML program and helping suppliers become CSR compliant has allowed IPC to become a vital resource for suppliers in Asia.
Here’s a list of the top 10 most viewed PCB interviews in the past year.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Takaya Focusing On Customer Engagement
04/08/2025 | Real Time with...IPC APEX EXPODavid Levine discusses the two new Takaya flying probe tester models on the show floor this year. The advanced features include an innovative liquid lens technology for improved focus in industrial applications, and zero impact probes for RF boards. Real map technology enhances testing accuracy, while eighth generation system improvements even offer remote viewing. The integration of potential for AI with test data is also discussed.
Real Time with... IPC APEX EXPO 2025: Navigating Economic Headwinds in the Electronics Industry
04/08/2025 | Real Time with...IPC APEX EXPOShawn DuBravac, IPC Chief Economist, highlights the industry's resilience amid economic challenges, noting ongoing investment despite uncertainty and rising interest rates. Consumer behavior shows caution, with slowing spending and weakening confidence. A global economic overview reveals strengths in the U.S., challenges in China, and struggles in Europe. The discussion emphasizes the negative impact of tariffs and the importance of resilient supply chains.
Electronics Industry Reimagines the Possibilities at IPC APEX EXPO 2025
04/07/2025 | IPCThe electronics industry is driven by innovators and problem-solvers, and IPC APEX EXPO 2025 provided endless opportunities to connect, collaborate, and shape the future.
Real Time with... IPC APEX EXPO 2025: IEC Competes Effectively Gaining Market Share
04/07/2025 | Real Time with...IPC APEX EXPOKelly Dack speaks with Chris Hrusovsky of IEC at IPC APEX EXPO. IEC, a 60-year-old distribution company, operates in the U.S. and Canada, sourcing U.S.-made products like chemicals for printed circuit boards. Despite previous pandemic-related sourcing challenges, IEC has ensured a steady supply, while addressing customer concerns about tariffs and pricing.
IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging
04/09/2025 | Tracy Riggan, IPCThe IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.