-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
NextFlex Recognizes Heroes of Flexible Hybrid Electronics
February 22, 2019 | Business WireEstimated reading time: 2 minutes

NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, acknowledged nine dedicated individuals who have made remarkable contributions to advancing the flexible hybrid electronics (FHE) ecosystem and industrializing the FHE manufacturing process at this year’s FLEX conference, during the third annual presentation of the NextFlex Fellow Award.
NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, recognized key volunteers through its annual Fellow awards. Pictured here (L to R) are: ACI CEO Dana Hankey who accepted the award on behalf of Mike Mastropietro, VP Engineering, ACI Materials; Pradeep Lall, Ph.D., John and Anne MacFarlane Endowed Professor and Director, Auburn University; Nancy Stoffel, Ph.D., Senior Engineering Professional/Project Manager, GE Global Research; Chris Stoessel, Ph.D., Sr. Manager, Process Development, Eastman Chemical; Malcolm Thompson, NextFlex Executive Director; John Williams Ph.D., Associate Technical Fellow, Boeing Research and Technology; Jeff Stuart, Ph.D., Emerging Technology External Portfolio Lead, Lockheed Martin, and Bruce Hughes, Lead FHE Engineer, AMRDEC. Not pictured: Scott Anderson, Ph.D., Research Scientist Senior Staff, Lockheed Martin and Craig Herndon, Director, Critical Technologies Innovation Center, Naval Surface Warfare Center, Crane Division.
The winners received the Fellow Award for their work in accelerating the development of FHE in emerging technologies, manufacturing, defense, aerospace, and medical applications, as well as workforce development.
This year’s NextFlex Fellow Award winners are:
Scott Anderson, Ph.D., Research Scientist Senior Staff, Lockheed Martin
Craig Herndon, Director, Critical Technologies Innovation Center, Naval Surface Warfare Center, Crane Division
Bruce Hughes, Lead FHE Engineer, AMRDEC
Pradeep Lall, Ph.D., John and Anne MacFarlane Endowed Professor and Director, Auburn University
Mike Mastropietro, VP Engineering, ACI Materials
Chris Stoessel, Ph.D., Sr. Manager, Process Development, Eastman Chemical
Nancy Stoffel, Ph.D., Senior Engineering Professional/Project Manager, GE Global Research
Jeff Stuart, Ph.D., Emerging Technology External Portfolio Lead, Lockheed Martin
John Williams, Ph.D., Associate Technical Fellow, Boeing Research and Technology
“The nine award recipients have been tirelessly working at the forefront of moving FHE development toward greater manufacturability and commercialization,” said Dr. Malcolm Thompson, executive director for NextFlex. “Partnering with NextFlex, these exceptional industry leaders are leading the charge to make ‘electronics on everything’ a reality in the near future, enabling innovative commercial and military applications that we couldn’t imagine today.”
These award winners have proven to be stellar advocates for advancement and development of FHE in their respective fields, replacing bulky and rigid form factors with flexible and wearable devices attached directly onto substrates for consumers, even human skin. In addition to recognizing these individuals’ phenomenal accomplishments, the awards acknowledge that collaborating with NextFlex and its members will significantly increase the pace of FHE technology development, manufacturing processes and commercialization, as well as inspire new markets and innovative products.
About NextFlex
NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network of Institutes. Formed through a cooperative agreement between the U.S. Department of Defense (DoD) and FlexTech Alliance, NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex’s elite team of thought leaders, educators, problem solvers, and manufacturers has come together to collectively facilitate innovation, narrow the manufacturing workforce gap, and promote sustainable manufacturing ecosystems.
Suggested Items
RTX, Shield AI Partner to Develop New Defense Capabilities
07/01/2025 | RTXRTX and Shield AI announced a new partnership to integrate Shield AI capabilities into select RTX defense products, like loitering munitions and sensors. This collaboration will deliver enhanced, autonomous capabilities to US and allied defense forces.
Lockheed Martin Completes Acquisition of Amentum’s Rapid Solutions Portfolio
07/01/2025 | Lockheed MartinLockheed Martin has closed its acquisition of the Rapid Solutions business of Amentum, an engineering and technology solutions company.
Saab Receives Order for Ground-Based Air Defense from Sweden
07/01/2025 | SaabSaab has received an order from the Swedish Defense Materiel Administration (FMV) for the mobile short-range air defense solution RBS 70 NG with missiles.
Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
07/01/2025 | KitronKitron has received an order valued at EUR 11 million to produce advanced military communication products destined for the European market.
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
06/17/2025 | Jesse Vaughan -- Column: Beyond the Board“The next war might be won—or lost—22,000 miles above Earth.” That’s not science fiction. It’s the stark reality defense planners are beginning to confront as space transitions from a support domain to a full-spectrum warfighting environment. For decades, the United States held an uncontested advantage in space, relying on exquisite, few, and highly capable systems to enable precision warfare, real-time intelligence, and global communications. Today, that edge is under siege.