Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Ventec at APEC 2019: Thermal Management and IMS Solutions for Power Electronics
March 6, 2019 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group will showcase its latest power electronics PCB material technology innovations at APEC 2019, which is taking place at the Anaheim Convention Center from March 18-20 in Anaheim, California, USA. The Ventec technology team will be on hand on booth #438 showcasing unique laminate & prepreg capability solutions designed for the most demanding thermal applications.
Ventec is set to further strengthen its position as a global leader in technology for high-performance thermal management and signal integrity materials at the Applied Power Electronics Conference in Anaheim, USA on booth #438.
Show highlights include:
VT-4B Series IMS – thermal conductivity from 1.0 to 10.0 W/m.K
For superior thermal dissipation of an insulated metal substrate (IMS), VT-4B series materials offer the perfect performance and properties. VT-4B1 is designed for bending and forming with thermal conductivity of 1.0 W/m.K, for minimum Zth 0.078°C*in2/W. From VT-4B3 to VT-4B9, the family provides a broad choice of thermal performance: 3 W/m.K to 10.0 W/m.K, and minimum Zth from 0.026°C*in2/W to 0.0078°C*in2/W satisfy demanding applications including high power-density converters and power supplies. For direct-to-metal connection of electrically isolated heat sources, VT-4B5SP selective preference substrates ensure maximum thermal efficiency and place dielectric insulation only where needed.
VT-5A2—Highest performance thermally conductive laminate material
The perfect choice for hybrid multilayer low-loss constructions, VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed. The lead-free assembly compatible material sets itself apart by offering highest performance thermal conductivity 8 times that of FR-4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 minutes, T288 >30 minutes and T300 >15 minutes) and MOT of 130°C.
tec-speed 20.0—No more compromises—performance, price & availability
Power amplifiers are one of the world's most demanding printed circuit board applications where high frequency performance, loss characteristics and reliability are key. tec-speed 20.0 (VT-870) offers all three and more: unrivalled performance with Dk 3.00-3.48 and Df 0.002-0.0037, superior loss characteristics and highest reliability, combined with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.
Thermal Interface Materials
As a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s, EMI Thermal’s thermal interface materials (TIM) will be presented on the booth. The range of materials distributed through Ventec includes double-sided thermal tape, electrical insulators, natural graphite and void fillers, that ensure reliability and performance and prevent electronic components from overheating and being damaged or burnt out.
About Ventec International Group
Ventec International is a premier supplier to the global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR-4, high-speed/low-loss- and high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.