-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Flex/MSTC Joint Conference: A Collaborative Week in Monterey
March 6, 2019 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute

Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/MEMS&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019. Known officially as the Flexible Electronics Conference and Expo and the MEMS & Sensors Technical Conference, respectively, these two events shared event space for the second time. SEMI, the industry association representing the electronics supply chain, hosted this conference.
Keynote speakers included Dragos Maciuca from Ford Motor Company, Jason Jelinek from John Deere Electronics Solutions, John A. Rogers from Rogers Research Group, Peter Hartwell from TDK InvenSense, Nancy Ranxing Li from Verizon, and Kristofer Pister from UC Berkley.
"The more than 550 FLEX and MSTC 2019 attendees saw the future of flexible printed and hybrid electronics and the MEMS and sensor technologies that are helping us reinvent a wide range of biomedical, transportation and IoT applications,” said Dave Anderson, president of SEMI Americas. He continued, “Small, flexible skin-worn devices that can monitor an infant’s vital signs, agricultural sensing platforms capable of improving food production, and autonomous vehicles that are both safe and affordable were just a few innovations highlighted at the event. Globally recognized industry innovators showed us how these technologies will transform our lives.”
SEMI President and CEO Ajit Manocha took the opportunity during his opening remarks to launch SEMI’s young professionals outreach campaign with this video.
In the expo hall, 60 exhibitor companies were on hand to discuss their latest products and projects. The center of the hall featured a TechTALKS pavilion, which hosted 17 fast-paced presentations, including product demos and discussions of best practices. Also, with 123 papers and presentations overall—36 related to MSTC and 87 sessions related to flex technology—the technical presentations on the conference side of the event were vibrant and full of energy.
The SEMI staff brought a lot of educational outreach to the Flex/MSTC conference. University student work was showcased in the lobby with 11 student teams discussing their research in sensors and flex manufacturing techniques. Look for additional coverage of SEMI’s educational programs coming soon.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/17/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.