-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Insulectro Hires Kathy Linares as Vice President of IT
March 25, 2019 | InsulectroEstimated reading time: 2 minutes
Insulectro, the largest distributor of materials for use in printed circuits boards (PCB) and printed electronics manufacturing, has hired information technology expert Kathy Linares as vice president of IT.
“I’m pleased to announce the hiring of Kathy Linares,” said Patrick Redfern, President and CEO for Insulectro. “Advancing Insulectro’s use of technology is a priority for us. It touches every aspect of how we do business—from customer ordering to delivery. It’s imperative we stay current on IT resources and tools.
“Kathy has an impressive background in operational IT. Her diverse skillset in operations and technology was earned by working for a consulting firm and several high growth companies in manufacturing and distribution. This experience makes her a unique fit to help lead our companies into the future by utilizing technology,” Redfern added.
Linares was most recently Chief Information Officer for Orora, a publicly-held company offering tailored packaging solutions. During her 7-plus year tenure, her signature achievement was her leadership in procuring, designing, and implementing Orora’s SAP transition from a legacy ERP system involving over 2500 employees and 60 international business locations.
Linares recently commented about joining Insulectro, “This company has a long history of setting the gold standard for supplying and supporting the best advanced materials for PCB fabricators demanding speed and technology, but I am joining the company to help our customers make better boards faster.
“I believe that by tapping into newer technologies, Insulectro will be able to provide remarkably outstanding service to its customers as well as the PCB market in North America. I'm excited about this opportunity and thrilled to have joined such a great company and talented team!” Linares enthused.
Redfern concluded, “We’re committed to recruiting and hiring superstar teammates to join an already exceptional team armed with best-of-range products from world-class suppliers like Isola, DuPont, Oak Mitsui, Pacothane, LCOA, CAC, Focus Tech Chemicals, Shikoku, JX Nippon, and EMD Performance Materials. Expert people, outstanding products—it’s a winning combination. Insulectro continues to invest in its future and the addition of someone of Kathy’s expertise will help integrate these new technologies into improving our service to our customers. We continually look to becoming the easiest company to do business with.”
About Insulectro
Insulectro is the largest supplier of PCB materials used to manufacture circuit boards as well as materials for Printed Electronics. Insulectro combines its premier product offering with local inventory in 10 strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.
Insulectro supplies advanced engineered materials manufactured by Isola, DuPont, LCOA, CAC, Inc., Pacothane, Focus Tech Chemicals, Shikoku, JX Nippon, EMD Performance Materials, and Oak Mitsui. These products are used by our customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military, and medical. For more information visit www.insulectro.com.
Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.