1g-Ultrasound System for the Brain Stimulation of a Freely-moving Mouse
March 28, 2019 | KAISTEstimated reading time: 2 minutes

A KAIST research team developed a light-weight capacitive micromachined ultrasonic transducer (CMUT) and succeeded in the ultrasound brain stimulation of a freely-moving mouse. With this lightweight and compact system, researchers can conduct a versatile set of in vivo experiments.
Conventional methods for stimulating a specific brain region, such as deep brain stimulation (DBS) and optogenetics technology, are highly invasive because they have to insert probes into a target brain, which makes them difficult to use for clinical application. While transcranial magnetic stimulation (TMS) and transcranial electrical stimulation (TES) are noninvasive, they have a wide range of stimulation and problems with in-depth stimulation, which makes them problematic for target-specific treatment.
Therefore, noninvasive and focused ultrasound stimulation technology is gaining a great deal of attention as a next-generation brain stimulation alternative. Since it is delivered noninvasively, it can be applied safely in humans as well as animal experiments. Focused ultrasound stimulation is more advantageous than conventional methods in terms of providing both local and deep stimulation.
Animal behavior experiments are essential for brain stimulation research; however, ultrasonic brain stimulation technology is currently in the early stages of development. So far, only research outcomes with fixed anesthetized mice have been studied because of the heavy ultrasonic device.
Professor Hyunjoo J. Lee from the School of Electrical Engineering and her team reported a technology that can provide ultrasound stimulation to the brain of a freely-moving mouse through a microminiaturized ultrasound device.
The team studied miniaturization and ultra-lightweight CMUTs through microelectromechanical systems (MEMS) technology and designed a device suitable for behavior experiments. The device weighing less than 1g (around 0.05% of the mouse’s weight) has the center frequency, size, focal length, and ultrasonic intensity to fit a mouse’s dimensions.
To evaluate the performance of the ultrasonic device, the team stimulated the motor cortex of the mouse brain and observed the movement reaction of its forefoot. They also measured the electromyography (EMG) of the trapezius.
As a result, the team confirmed that their ultrasonic device can deliver ultrasound to a depth of 3-4mm in the mouse brain and stimulate an area of the mouse brain that represents 25% of its total size.
Based on this research, the team is investigating the effects of ultrasound on sleep by stimulating the brain of sleeping mice.
Professor Lee said, “Going beyond experimenting on fixed anesthetized mice, this research succeeded in the brain stimulation of a freely-moving mouse. We are planning to study mice with diseases, such as Parkinson’s disease, dementia, depression, and epilepsy. I believe that this basic research can contribute to treating human brain-related diseases through ultrasound brain stimulation."
About KAIST
Korea Advanced Institute of Science and Technology (KAIST) was established in 1971 to model a research focused university and to foster elite human resources in science and technology needed by the nation.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in