Lockheed Martin Wins $20 Million Contract for U.S. Navy’s AN/BLQ-10 System
April 22, 2019 | Lockheed MartinEstimated reading time: 1 minute
Lockheed Martin was awarded a $20 million contract for engineering and technical services for the AN/BLQ-10 Electronic Warfare System Technology Insertion (TI)-20, TI-22 and TI-24.
The AN/BLQ-10 system includes extensive COTS and non-developmental item hardware and software that is cost-effective to meet operational requirements and life-cycle costs. The AN/BLQ-10 system is an open architecture platform to accommodate current and future mission needs and technology upgrades.
“Lockheed Martin is honored to be selected to provide the next generation electronic warfare system for the U.S. Navy,” said Joe Ottaviano, Electronic Warfare program director, Rotary and Mission Systems. “The AN/BLQ-10 system will continue to provide our warfighters with situational awareness and enhanced capabilities that outpace the threat.”
The AN/BLQ-10 submarine electronic warfare system processes radar signals through masts and periscopes to detect threats such as counter detection, collision and target locations. Crews can rapidly analyze and identify critical signals to determine hostile, neutral or friendly situations.
The contract includes the design, development, testing, integration, technology insertion/refreshment and system support of new-construction and in-service submarines.
Lockheed Martin has provided the U.S. Navy with AN/BLQ-10 systems since 2000 and continues to provide modernization kits and spares and integrated submarine subsystems. Work will be performed at the Electronic Warfare Center of Excellence in Syracuse, New York, and Manassas, Virginia.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.