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AI, HPC Fuel Advances in Packaging Technology 3DIC, FOPLP, and Chiplet Forums Gain Global Spotlight
July 3, 2025 | SEMIEstimated reading time: 2 minutes
As demand for AI and HPC accelerates, the semiconductor industry is embracing a new era. With Moore’s Law slowing and scaling challenges rising, technologies like 3DIC, panel-level fan-out (FOPLP), chiplets, and co-packaged optics (CPO) are becoming essential for next-level performance and system integration. SEMICON Taiwan 2025 will spotlight these advances through global forums starting September 8, ahead of the main exhibition from September 10–12 at Taipei Nangang Exhibition Center.
Explosive Growth in Advanced Packaging Market Redefines Industry Value Chain
“Fueled by soaring AI demand, advanced manufacturing capacity is expected to hit a record 1.4 million wafers per month by 2028,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “As AI demands surpass the limits of single-chip scaling, advanced packaging technologies like 3DIC and FOPLP are essential for system-level integration. With the industry moving from a linear supply chain to a more integrated and collaborative ecosystem, SEMICON Taiwan 2025 will serve as a vital global platform for industry leaders to explore how packaging and manufacturing innovation can unlock new commercial value across the semiconductor landscape.”
SEMI Promotes Global Collaborative Platform – 3DIC Advanced Manufacturing Alliance
As global supply chains are restructuring and geopolitical tensions rise, Asia is accelerating advanced packaging innovation, with Taiwan emerging as a strategic hub. To drive global collaboration and next-gen system integration, SEMI will officially launch the highly anticipated 3DIC Advanced Manufacturing Alliance (3DICAMA) at SEMICON Taiwan 2025. The alliance marks a key shift from single-chip to system-level solutions, aiming to boost cross-industry collaboration, enhance supply chain resilience, promote standards adoption, and speed up technology commercialization, laying the groundwork for a highly integrated and efficient packaging ecosystem.
World’s Top Advanced Packaging Platform at SEMICON Taiwan 2025
SEMICON Taiwan 2025 will host the Heterogeneous Integration Global Summit (HIGS), FOPLP Innovation Forum, and 3DIC Global Summit, covering critical topics from design and materials to process and supply chain. These high-level forums will map the future of advanced packaging and integration technologies. Industry leaders, including ASE, Broadcom, Lightmatter, MediaTek, Nvidia, Sony, and TSMC, will join HIGS Series to tackle challenges in 3DIC, CPO, and AI packaging. At the FOPLP Innovation Forum, AMD and PTI experts will share the latest innovations and market applications strategies.
This year’s Heterogeneous Integration Area will expand to three pavilions: 3DIC Advanced Packaging, FOPLP, and Semiconductor Packaging, featuring cutting-edge technologies, tech demonstrations, industry standards, and supply chain collaboration. Leading companies such as Innolux, PTI, Comet, Coherent, E&R Engineering, GP, Lam Research, Manz, Mirle, PDF Solutions, PSK, Shibaura, and Utechzone will showcase state-of-the-art system-level solutions and integration applications, offering attendees key insights and partnership opportunities.
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