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IPC APEX EXPO 2020 Deadline for Papers: June 21
June 20, 2019 | IPCEstimated reading time: 1 minute
IPC APEX EXPO is the electronics industry's premier technical conference and exhibition, drawing an international audience to experience the latest advancements in design, materials, assembly, processes, inspection, and equipment. Areas of interest are diverse and ever-changing to keep up with the pace of innovation.
Presenting at IPC APEX EXPO provides visibility for you and your organization. The proceedings from the technical conference reach an audience of thousands and are regarded as the best place to follow current technologies and best practices. Your material will be seen by key managers and executives from all segments of the worldwide electronics industry. To recognize exceptional achievement, awards will be presented for "Best Paper."
Presenters from companies such as Ericsson AB, Flextronics, IBM Corporation, Indium Corporation, MacDermid-Enthone, Northrop Grumman Corporation, Oracle Corporation and Robert Bosch GmbH have published papers at previous technical conference sessions at IPC APEX EXPO.
Professional development courses are also a great way to delve deeper into the challenges facing the electronics industry. Instructors of these courses have the largest potential audience and reach a wide swath of attendees focused on learning. This is also a great way to pass on knowledge based on years of experience and leave a legacy.
Technical Conference
Provide an abstract of approximately 300 words that summarizes technical work, covering case histories, research and discoveries. Authors of papers selected for the conference will each receive a detailed speaker manual to assist them with numerous items, including the formatting of their papers and presentation slides.
Conference Paper Timeline: Abstracts due June 21, 2019
Professional Development Courses
Course proposals are solicited from individuals interested in teaching half-day (three-hour) professional development courses on design, manufacturing processes, materials, supply chain and reliability. Travel expenses and honorariums are offered to professional development instructors.
Professional Development Timeline: Proposals due June 24, 2019
For more information on topics, speaker benefits and speaker recognition awards, please visit ipcapexexpo2020.ipc.org/cfp.
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Rachael Temple - AlltematedSuggested Items
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.