Psychosensory Electronic Skin Technology for Future AI and Humanoid Development
September 20, 2019 | DGISTEstimated reading time: 2 minutes
DGIST announced that Professor Jae Eun Jang’s team in the Department of Information and Communication Engineering developed electronic skin technology that can detect “prick” and “hot” pain sensations like humans. This research result is expected to be applied on the development of humanoid robots and patients wearing prosthetic hands in the future.
The attempt to mimic human’s five senses led to the development of innovative electronic devices such as camera and TV, which are inventions that dramatically changed human life. As a result, many scientists are continuously performing research to imitate tactile, olfactory, and palate senses and tactile sensing is expected to be the next mimetic technology for various reasons. Currently, most tactile sensor researches are focusing on physical mimetic technologies that measure the pressure used for a robot to grab an object, but psychosensory tactile research on how to mimic human tactile feeling such like soft, smooth or rough has a long way to go.
As a result, Professor Jae Eun Jang’s team developed a tactile sensor that can feel pain and temperature like human through a joint research with Professor Cheil Moon’s team in the Department of Brain and Cognitive Science, Professor Ji-woong Choi’s team in the Department of Information and Communication Engineering, and Professor Hongsoo Choi’s team in the Department of Robotics Engineering. Its key strengths are that it has simplified the sensor structure and can measure pressure and temperature at the same time and can be applied on various tactile systems regardless of the measurement principle of the sensor.
For this, the research team focused on zinc oxide nano-wire (ZnO Nano-wire) technology, which was applied as a self-power tactile sensor that does not need a battery thanks to its piezoelectric effect, which generates electrical signals by detecting pressure. Also, a temperature sensor using Seebeck effect1) was applied at the same time for one sensor to do two jobs. The research team arranged electrodes on polyimide flexible substrate, grew the ZnO nano-wire, and could measure the piezoelectric effect by pressure and the Seebeck effect by temperature change at the same time. The research team also succeeded in developing a signal processing technique that judges the generation of pain signals considering the pressure level, stimulated area and temperature.
Professor Jang in the Department of Information and Communication Engineering said “We have developed a core base technology that can effectively detect pain, which is necessary for developing future-type tactile sensor. As an achievement of convergence research by experts in nano engineering, electronic engineering, robotics engineering, and brain sciences, it will be widely applied on electronic skin that feels various senses as well as new human-machine interactions. If robots can also feel pain, our research will expand further into technology to control robots’ aggressive tendency, which is one of the risk factors of AI development.”
This research was participated by combined M.S.-Ph.D. program student Minkyung Shim in the Department of Information and Communication Engineering as the first author and was published on the online edition of internationally-renowned journal Soft Robotics on Tuesday, July 23.
Suggested Items
Siemens Unveils Next Generation AI-enhanced Electronic Systems Design Software
11/13/2024 | SiemensSiemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™ software and PADS™ Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.
Happy’s Tech Talk #34: Producibility and Other Pseudo-metrics
11/12/2024 | Happy Holden -- Column: Happy’s Tech TalkAs an engineer, I thrive on data, and one of my favorite forms is metrics. However, the one metric that has always challenged me is producibility. I define this as more than just passing a DRC in CAM, but the entire envelope of “simplicity of design,” “suitability for test,” and many more. Yet, producibility seemed to be different for different engineers and we had no clear way to establish and define producibility other than opinion. When I worked at HP, the company invested in a methodology called design for manufacturing and assembly using the GE/Hitachi Methodology and Dewhurst-Boothroyd software. Finally, I had a methodology that created a producibility score.
The Quest for Perfect Products
11/11/2024 | Marcy LaRont, I-Connect007Anna-Katrina Shedletsky is a former Apple engineer who formed her own company, Instrumental, to address what she felt were frustrating and costly engineering problems and inefficiencies at Apple. She’s passionate about her quest to build perfect products faster than ever before. In this interview, Anna shares her journey from creating innovative products like the Apple Watch to addressing the complexities of failure analysis in manufacturing. She also discusses an upcoming educational webinar she is hosting with Valentina Ratner, CEO of AllSpice.io, for engineering leaders in the manufacturing space. They look forward to providing “real talk” and value to their engineering colleagues.
Cicor Expands into Sweden with Plans to Strengthen Market Position in Germany
11/08/2024 | CicorCicor Group has acquired the Swedish development company Nordic Engineering Partner AB and thus establishes a significant presence in the Nordics. Additionally, Cicor is in advanced negotiations to acquire another German EMS provider.
Root-cause Analysis and Problem-solving
11/01/2024 | Happy Holden, I-Connect007An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.