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                                                                                                        The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
                                                                                                        Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
                                                                                                        Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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Amphenol Invotec to Exhibit at Space Tech Expo Europe
September 22, 2019 | Amphenol InvotecEstimated reading time: 1 minute
Amphenol Invotec will be showcasing its PCBs alongside the extended range of interconnect solutions available from Amphenol for the space sector at Europe's largest B2B space event—the Space Tech Expo in Bremen, Germany, November 19–21, 2019.
As one of Europe’s leading Space events, Space Tech Expo showcases the latest from technical designers, sub-system suppliers, component manufacturers and systems integrators for civil, military and commercial space. The exhibition and conference draw attendance from thousands of industry leaders, decision-makers, engineers, specifiers and buyers to meet manufacturers across the supply chain for civil, military and commercial space. Over the three days, industry experts will share their insights on the most important developments and challenges facing space engineers and manufacturers today.
Amphenol Invotec is working closely with the industry to ensure it is the leading PCB interconnect solution provider for the next generation of space programmes. Amphenol Invotec offers a comprehensive range of PCB technologies, supported by a wealth of "design for manufacture" expertise, all of which is underpinned by a detailed working knowledge of space industry standards.
The Amphenol Invotec team works with some of the most exciting names in the space sector today, ranging from major OEM primes through to second and third subsystem contractors and universities.
Amphenol Invotec supports the complete product life cycle: Design for Manufacture, bread-board, engineering model through to flight model status.
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Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.