-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Copper Clad Laminates Market Demand to Hit $15 Billion by 2025
September 30, 2019 | Globe NewswireEstimated reading time: 2 minutes
Global Market Insights, Inc. has recently added a new report on copper clad laminates market which provides a succinct analysis of the market size, revenue forecast and the regional landscape. The report states the global copper clad laminates market is set to cross USD 15 billion revenue by 2025 driven by rising demand from automotive industry, as it holds prime importance in printed circuit board (PCB) fabrication owing to superior conductivity and insulation properties. The automotive industry is rapidly revolutionizing with emphasis on passenger safety, comfort and convenience. Various safety features such as alert system, blind-spot detection system and lane departure system, etc. require PCBs for effective functioning.
By product, the copper clad laminates market is segmented into rigid and flexible. Flexible segment will grow at a CAGR more than 4% owing to rising popularity within automobile and healthcare sectors. Based on reinforcement material, market is bifurcated into paper base, glass fiber and compound materials. Paper base segment is expected to record over USD 3 billion by 2025.
Some of the market growth drivers:
- Growing demand for PCBs in several end-use industries
- Swelling consumption in 5G communication equipment
Based on resin, market is divided into epoxy, phenolic and polyimide. Epoxy will clutch significant market share owing to excellent chemical, mechanical and electrical properties. Based on application, the market is classified into computers, communication systems, consumer appliances, vehicle electronics, healthcare devices, defense technology and others. Computers will grow at a CAGR more than 4% over the forecast period as copper clad laminates are used on large scale for PCBs in computing operations.
Asia Pacific will dominate the copper clad laminates market in upcoming years. The strong growth is attributable to high demand from communication systems and automotive sectors. Europe will grow at a CAGR over 3.5% due to increasing product usages in healthcare, defense and aerospace sectors.
Browse key industry insights spread across 310 pages with 831 market data tables & 18 figures & charts from the report, “Copper Clad Laminates Market Size By Product (Rigid, Flexible), By Reinforcement Material (Glass Fiber, Paper Base, Compound Materials), By Resin (Epoxy, Phenolic, Polyimide), By Application (Computers, Communication Systems, Consumer Appliances, Vehicle Electronics, Healthcare Devices, Defense Technology), Industry Analysis Report, Regional Outlook (U.S., Canada, Germany, UK, France, Italy, Spain, China, India, Japan, South Korea, Thailand, Taiwan, Brazil, Mexico, Israel, UAE, South Africa,), Growth Potential, Price Trends, Competitive Market Share & Forecast, 2019 – 2025” in detail along with the table of contents:
Taiwan Union Technology Corporation, Doosan Corporation, ITEQ Corporation, Shandong Jinbao Electronics Co., Ltd., Guangdong Chaohua Technology Co., Ltd., NAN YA Plastics Industrial Co., Ltd. and Panasonic Corporation are some of the major manufacturers in the copper clad laminates market share.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.