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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Rigid-flex PCB Market Gaining Expansion Momentum
October 4, 2019 | DigitimesEstimated reading time: Less than a minute
The market for rigid-flex PCBs, though smaller than those for other PCB product lines, is gaining expansion momentum as more PCB makers in Taiwan and China are moving to expand their rigid-flex board businesses to tap potential demand driven by increasing IoT and automotive applications.
Currently, battery modules, camera lens modules and true wireless stereo (TWS) headsets are the three major application segments for rigid-flex boards. PCB makers are most eager to tap the camera module segment as rigid-flex boards are the top choice for such modules whether used in handsets or automobiles.
Suggested Items
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
06/18/2025 | SEMIFlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.
Flex CEO Sees US Manufacturing Resurgence
06/18/2025 | I-Connect007In a June 16 interview on Bloomberg Open Interest, Flex CEO Revathi Advaithi said the supply chain is already shifting, with more goods now being manufactured in the U.S.