Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
It's Only Common Sense: The Evolution of Prospecting
Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
AT&S Advocates Upgrading Logistics Services in Chongqing by Digitization and Innovation
October 9, 2019 | AT&SEstimated reading time: 1 minute
AT&S attended the 14th Annual Meeting of the Chongqing Mayor’s International Economic Advisory Council (CMIA) in Chongqing, China on September 28, 2019. It is the fifth consecutive year for the company to participate in this most influential event. During the conference, Andreas Gerstenmayer, CEO of AT&S shared his insights to support Chongqing’s ambitious goal—building an inland international logistics hub.
Gerstenmayer hosted one of the panel discussions and kicked off the topic with a key note. He underlined that Chongqing should pursue a sustainable development way by increasing logistics efficiency and improving environmental impact.
Digital transformation in logistics including port services is inevitable. It leads to improved visibility, adaptability, efficiency and automation across the city’s supply chain network, while bringing important social and environmental benefits by cutting down energy consumption and emissions, and help to manage the increased demands brought on by the Belt and Road Initiative.
Secondly, streamline industry value chain, for example, boosting semiconductors ecosystem is vital for Chongqing. Semiconductors play a key role for almost every high-tech industry such as computers, communication devices, automotive and others. Industry clusters in Chongqing could reduce logistics costs and stimulate demand across a range of value chains, thus creating considerable market opportunities for materials and equipment suppliers, microchip manufacturers and consumer electronics producers.
Thirdly, Chongqing can also help themselves and the industries by reinforcing a local curriculum and encouraging collaboration between foreign partners with Chinese universities and research institutes. Gerstenmayer introduced AT&S’s academic collaboration with Chongqing University. It includes partnering on research programs, developing curriculum in IC substrates, sharing technical expertise and offering specialized internships.
“At AT&S, we realize the journey towards innovation is enhanced through collaboration. That’s why we develop relationships in academia and invest in universities in Chongqing, working with the brightest minds to transform research into solutions”, explains Gerstenmayer.
At the conference, Gerstenmayer also shared AT&S’ growing experience with Chongqing and China. With the combination of existing and new technologies particularly established in Chongqing, AT&S offers a comprehensive high-end range of interconnect solutions for miniaturization and modularization for the semiconductors industry but also for the high-end microelectronics value chain. AT&S is fully committed to investing in technology and innovation in Chongqing and supporting the city’s prosperous future.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Nolan’s Notes: Everyone Has Their Eye on India
09/03/2025 | Nolan Johnson -- Column: Nolan's NotesIn this issue of SMT007 Magazine, we turn our attention to the Indian EMS market. We start with an interview with David Bergman, whose foresight in the early 2000s opened doors for the Global Electronics Association to begin helping Indian EMS companies with standards and certifications that would give EMS companies a footing to enter a global EMS market.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.