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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Why PCB Fabricators Need to Be at the SMTA Additive Electronics Conference
October 16, 2019 | I-Connect007Estimated reading time: Less than a minute
When I-Connect007 asked Tara Dunn, Omni PCB president and conference co-chair, about the types of applications discussing or adopting additive PCB technology, she replied, "Applications that need extremely thin copper, are concerned with space and weight, and have complex pin-outs, pushing the capabilities of traditional PCB manufacturing, could utilize SAP or mSAP technology. If you’re not using this kind of technology now, the chances are good that you will be soon."
Tara will also be attending and moderating a panel discussion at the conference.
Don’t miss out; start your research. Attend the SMTA Additive Electronics Conference on October 24, 2019, to launch your expertise in additive electronics.
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