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Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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Industry Experts at the SMTA Additive Electronics Conference
October 21, 2019 | I-Connect007Estimated reading time: Less than a minute
Why should you attend the SMTA Additive Electronics Conference: PCB Scale to IC Scale? To build your expertise with these expert speakers:
- Wilfried Bair, VP engineering, NextFlex
- Nathan Khosla, senior research scientist, Lockheed Martin
- Beth Paquette, flight systems design, NASA-GSFC
- Brian Hess, chemical/process engineer, Calumet Electronics
- Rahul Raut, director, strategy/tech. acq., MacDermid Alpha Electronics Solutions
- Bawa Singh, exec. VP, tech and corp. dev., MacDermid Alpha Electronics Solutions
- Steve Vetter, electronics engineer, Naval Surface Warfare Center, Crane
- Mike Vinson, president, Averatek
- Will Wallace, general manager, SAT Plating
Don’t miss out; start your research. Attend the SMTA Additive Electronics Conference on October 24, 2019, to launch your expertise in additive electronics.
Suggested Items
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STMicroelectronics, Innoscience Sign GaN Technology Development and Manufacturing Agreement
04/02/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Innoscience, the world leader in 8” GaN-on-Si (gallium nitride on silicon) high-performance low-cost manufacturing, announce the signature of an agreement on GaN technology development and manufacturing, leveraging the strengths of each company to enhance GaN power solutions and supply chain resilience.
TT Electronics Juárez Recognised for Commitment to Human Rights
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Federal Electronics Welcomes Joel Robbins as New Business Development Manager
04/02/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, is pleased to announce the appointment of Joel Robbins as Business Development Manager.
Winners of 2025 IPC Masters Competition China Announced
04/02/2025 | IPCOn March 26-28, the IPC Masters Competition China was successfully held in Pudong, Shanghai. This year’s competition brought nearly 500 electronics industry elites from 18 provinces and municipalities.