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iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

04/26/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.

Cicor Records Solid Growth in Q1

04/16/2024 | Cicor
The Cicor Group continued to grow in the first three months of the year. Quarterly sales increased by 11.8% to CHF 107.3 million compared to the first quarter of the previous year (Q1/2023: CHF 96.0 million).

Cicor Successfully Completes Acquisition of TT Electronics IoT Solutions Ltd.

04/03/2024 | Cicor
The Cicor Group has successfully completed the acquisition of TT Electronics IoT Solutions Ltd. with three production sites in the UK and China.

Hee Wei Ken to Present Whitepaper on A.I. Integration in Automated X-ray Inspection (AXI) Process at IPC APEX EXPO 2024

04/03/2024 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce that our Senior Product Marketing Engineer and AXI Technical Specialist, Mr. Hee Wei Ken, will be speaking at the IPC APEX EXPO 2024 Technical Conference.

Machine Vision Products Unveils Versa Duo and Advanced Deep Learning AI Tools at IPC APEX EXPO 2024

04/02/2024 | Machine Vision Products
Machine Vision Products (MVP) is thrilled to announce the debut of its latest innovation, the Versa Duo, aiming to reshape Automated Optical Inspection capabilities.
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