Global Citizenship: Cultural Nuances Around the World
The Government Circuit: Four Things to Know About IPC Advocacy in 2025
Global Sourcing Spotlight: Seven Key Challenges in Offshore Manufacturing
David Meyers on Digital Twin and ‘Cobots’
November 26, 2019 | Nolan Johnson and Happy HoldenEstimated reading time: 1 minute
With over 30+ years in the industry, David Meyers recently took on a new role at Siemens as a global solutions director in the Electronics Industry team of Siemens Digital Industries Software, working on improving communications between CMs and their OEM partners. In a conversation with Nolan Johnson and Happy Holden, David speaks on the digital twin and virtual environment software that should help establish that communication early in the process.
Nolan Johnson: David, can you start with a bit of background on yourself and your role in Siemens?
David Meyers: I’ve been in product development for about 35 years. I started at the end of 1981 while going to school. After working at the Department of Defense as a drafter, I learned CAD and worked at several companies, including Westinghouse, Motorola, Panasonic, and Dell. I spent the past 17 years with Dell, and then I had an opportunity to come on board with the industries group at Siemens because of my extensive background in product development and mechanical engineering. I led a team in the chief technology office at Dell for the last five years. I have a lot of familiarity with the OEM/ODM contract manufacturing model. At Siemens, I focus on the realization side, which is from engineering to manufacturing and developing the product from a hardware/software perspective.
Happy Holden: How do you see the industry landscape from your perspective?
Meyers: I’ve been around for a long time. I started my career doing drafting on the board, so pencils, paper, and lots of eraser shavings. We moved on over the years through using CAD systems, which have developed from wireframes to full-surface and solid models. Today, we have the capability to design products and have full simulation packages that demonstrate user environments and/or use case or safety reliability. You can do all of that, so that’s a significant change. And I think that momentum is continuing.
To read this entire interview, which appeared in the November issue SMT007 Magazine, click here.
Share on:
Suggested Items
J.A.M.E.S. Explores the Future of Additive Manufactured Electronics
02/18/2025 | Marcy LaRont, I-Connect007Andreas Salomon is chief scientist at J.A.M.E.S, a joint venture of Nano Dimension and HENSOLD. In this interview he discusses the evolving landscape of additively manufactured electronics, highlighting the integration of cutting-edge technologies, such as micro-dispensing and ink jetting. These technologies enhance capabilities in signal integrity and miniaturization. He also talks about the importance of sustainability, the need for standardized testing, and collaboration among industry leaders that will drive innovation and transform the future of electronics manufacturing through IPC’s standards development.
Würth Elektronik: PCB Threaded Connections Using Press-fit Technology
02/18/2025 | Würth ElektronikWürth Elektronik, manufacturer of electronic and electromechanical components for the electronics industry, presents its “REDCUBE PRESS-FIT for Automotive”, a new range of threaded connections specially optimized for the automotive industry.
ASMPT Presents High-performance LED Die Bonder
02/18/2025 | ASMPTASMPT, the world's leading supplier of hardware and software for semiconductor and electronics manufacturing, presents Vortex II, a high-performance die bonder for the production of mini LED displays, such as those used in the automotive industry.
I-Connect007 Welcomes New Milaero Columnist Jesse Vaughan
02/18/2025 | I-Connect007 Editorial TeamI-Connect007 is excited to announce the addition of a new monthly column, “Beyond the Board,” authored by Jesse Vaughan, a seasoned expert in the PCB/milaero sector. Jesse, a third-generation printed circuit board technologist currently working at Summit Interconnect, brings a wealth of knowledge and passion to our publications.
KYZEN to Showcase Stencil Cleaning Research Advancements at IPC APEX EXPO 2025
02/17/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit in Booth 642 at the upcoming 2025 IPC APEX EXPO, scheduled for March 18-20, 2025 at the Anaheim Convention Center. Celebrating 35 years of innovation and continuous improvement, KYZEN will spotlight its industry-leading research and solutions designed to advance electronics manufacturing processes.