The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
iNEMI Webinar to Share Results of Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project
February 19, 2020 | iNEMIEstimated reading time: 1 minute
The fine pitch substrate features of advanced packaging technologies such as SiP, 2.5D, etc., can directly impact yield and performance of the package. The Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology project has been organized to address the need to identify and characterize the capabilities of inspection technologies that can enable faster inspection and process development and, ultimately, higher yield in high-volume production.
This webinar will share the findings and recommendations from Phase 2 of the project, which studied the available measurement capabilities for fine line.
In addition, the webinar will outline the plans for the next phase of the project, which will focus on fabrication and inspection of organic substrates, using the TV designs from Phase 2. The team, led by Feng Xue (IBM), Joe Zou (Intel) and Charles Reynolds (IBM), plans to evaluate and quantify the limitations of automatic optical inspection (AOI) for fine pitch and defect patterns on organic substrates, and compare them to other relevant inspection methodologies. For additional project information.
Webinar Registration
The Phase 2 end-of-project webinar is being combined with the Phase 3 call-for-participation webinar. Two sessions are scheduled and are open to members and non-members. Participants must register in advance — please click on the links below to register. For additional information, contact Masahiro Tsuriya (m.tsuriya@inemi.org)
Session 1 (APAC)
March 5
10:00 a.m. JST (Japan)
8:00 p.m. EST (USA) on March 4
5:00 p.m. PST (USA) on March 4
Session 2 (Americas and EMEA)
March 5
8:00 a.m. EST (USA),
2:00 p.m. CET (Europe)
10:00 p.m. JST (Japan)
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Yamaha Boosts Surface-Mount Programming Efficiency with Latest Software Release
10/14/2025 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.
Arc-Tronics Strengthens Inspection Capabilities with Three New Saki AOI Systems
09/26/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that Arc-Tronics, Inc., a high-reliability EMS provider based in Elk Grove Village, Illinois, has recently installed three 3Di-LS3 Series Automated Optical Inspection (AOI) systems in its production facility.
Discover TRI's AI Ecosystem at productronica 2025
09/25/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is excited to announce its participation at productronica 2025, which will be held at Messe München Center from November 18 to 21, 2025.
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Machvision Leads Shift to Automated Inline Final Inspection, AOI in North America
09/10/2025 | Ralph Jacobo, all4-PCBSchweitzer Engineering Laboratories (SEL) chose Machvision inspection equipment due to its capabilities and versatility. Machvision of Taiwan offers circuit inspection, hole inspection and measurement, IC Substrate and HDI inspection, and final visual inspection solutions. The best fit for SEL was the 4.0Pro Circuit Inspection for inner and outer layers, and the AFI6 for final visual inspection of finished panels.