Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
With DIS, Accurate Registration is Everything
March 30, 2020 | Real Time with...IPCEstimated reading time: Less than a minute
During IPC APEX EXPO 2020 in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview from the show, Technical Editor Pete Starkey and Jesse Ziomek, VP of sales for DIS, discuss how the company achieves ultimate accuracy in layer-to-layer registration, not just in rigid multilayers, but also in flex and rigid-flex builds. Jesse also comments on keeping technology exciting enough to attract young engineers into the industry.
IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO is planned for January 26-28, 2021, at the San Diego Convention Center.
To watch this interview, click here.
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