Punching Out: New Year’s Goals for Selling a Business
The Government Circuit: How IPC Drove Industry Progress Through Public Policy Advocacy in 2024
Fein-Lines: CES 2025—The Consumer Technology Association's Super Event
Elsyca Introduces New Simulation Tools for PCB Copper Balancing
April 6, 2020 | ElsycaEstimated reading time: 1 minute
Copper plating is a very complex process that is impacted by the PCB design itself, by the panel layout and by the production configuration.
The ever-increasing complexity of the design and request to deliver in shorter amounts of time are even pushing experts to—and over—their limits.
In order to support the different players in this process, Elsyca has developed a new product suite for the PCB industry. One of the products, Elsyca PCBBalance will not only provide detailed information on the layer thickness distribution, but also optimizes PCB designs/panels for manufacturing through intelligent copper balancing.
In regard to copper balancing and its importance, Rick Hartley, Principal Engineer of RHartley Enterprises commented, “Copper balancing should be done, not only at the panel level in PCB FAB, but every PCB designer should be taught the many benefits of copper balancing and incorporate the concepts into their board designs.”
Elsyca’s PCBBalance simulation software allows users to master quality by providing detailed feedback on the layer thickness distribution and on top of that, also by generating the most performant copper balancing with a single mouse click.
The most critical areas on the panel will be identified, focusing testing resources on where they are most needed.
Key features include:
- DFM
- Identify layer thickness distribution over boards and panels
- Automated and optimized copper balancing
- Identify the most critical holes for post-production quality testing
- Compare different PCB design and panel layouts side by side
- Download copper balancing results
Click on the appropriate link below to find out how this software will help you in your specific role as a PCB Designer, CAM Engineer or Process Engineer.
To learn even more about Elsyca PCBBalance, download a copy of their white paper or find out in one of their webinars how simple it works.
Share on:
Suggested Items
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.