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Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
August 6, 2025 | BUSINESS WIREEstimated reading time: 1 minute
Point2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions. This collaboration breaks new ground in AI cluster scalability, ushering in a new category of cable interconnects to address the growing need for higher-performance interconnects within hyperscale data centers.
Through this strategic partnership, Point2 and FIT will develop and commercialize MSA-compliant 1.6T and 3.2T pluggable ARCs based on Point2’s UltraWave™ RF Transmitter and Receiver SoCs, and co-develop NPE solutions to enable a scalable compute fabric for AI Cluster scale-up for in-rack, cross-rack, and switch to NIC connectivity.
Unlike traditional copper and optical interconnects, Point2’s e-Tube RF transmission over plastic waveguide redefines scalability for AI clusters inside data centers. The technology extends transmission reach 10X beyond copper at a similar cost, while delivering 3X lower power consumption and an astounding 1,000X reduction in latency compared to optical interconnects. These advancements unlock unprecedented efficiencies for hyperscalers and chip accelerator manufacturers seeking the highest performance and best-in-class energy efficiency, at infrastructure costs comparable to those of copper.
“We are thrilled to partner with FIT, a recognized global manufacturing leader in high-speed cables and connectors, to clearly establish e-Tube technology as the forefront interconnect for future AI-driven workloads,” said Sean Park, CEO of Point2 Technology. “By removing the barriers and shortcomings of conventional copper and optical interconnects, Point2 continues to empower hyperscalers to scale up AI clusters efficiently while driving down cost, power, and latency.”
“This collaboration is a game-changer for AI computing and accelerated network interconnect,” said Julia Jiang, VP of Marketing and Sales at FIT Electronics. “Together, we will redefine interconnect strategies, equipping data centers with the tools to scale AI workloads seamlessly and cost-effectively for multi-generations.”
Point2 and FIT will jointly participate in industry trade shows, conferences, and co-marketing initiatives to accelerate the adoption and deployment of the disruptive e-Tube technology platform.
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Molex Announces Agreement to Acquire Smiths Interconnect
10/17/2025 | MolexMolex, a leading global electronics connectivity innovator, announced that it has signed an agreement to acquire Smiths Interconnect.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/26/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
Amphenol to Acquire Connectivity and Cable Solutions Business From CommScope
08/04/2025 | BUSINESS WIREAmphenol Corporation announced a definitive agreement to acquire CommScope’s Connectivity and Cable Solutions (CCS) business for $10.5 billion in cash, subject to customary post-closing adjustments.