Dynetics Awarded DARPA Air Combat Evolution (ACE) Phase 1
May 7, 2020 | Business WireEstimated reading time: 1 minute
Dynetics, Inc., a wholly owned subsidiary of Leidos, has been awarded Phase 1 of the Air Combat Evolution (ACE) program, Technical Area 3 (TA3), by the Defense Advanced Research Projects Agency's (DARPA) Strategic Technology Office (STO). ACE TA3, also known as Alpha Mosaic, is valued at $12.3 million.
The ACE program is using aerial dogfighting as the initial challenge scenario for implementing artificial intelligence (AI) into high-intensity air conflicts, which intends to increase warfighter trust in combat autonomy. Similar to how the United States military trains fighter pilots, ACE performers will work to increase trust in automated, within-visual-range, air-to-air dogfighting. As algorithms and tactics mature, so will the scenarios and adversarial capabilities.
During the 18-month Phase 1 award, Dynetics will leverage program advances in automated dogfighting to enable operational-level scenarios with a large number of heterogeneous aircraft. By improving the algorithms and tactics developed within ACE, TA3 will lay the groundwork for future live, campaign-level experimentation of manned and unmanned vehicles.
"The ACE program is inspiring on so many levels," said Tim Keeter, ACE program manager for Dynetics. "Our team brings novel solutions that have proven to be feasible and scalable to these challenging ACE objectives. These efforts will help DARPA and the U.S. military expand their advantage in the evolution of Mosaic warfare."
The program consists of three phases. Phase 1 begins research in a simulated environment. Phase 2 advances to a flight environment using unmanned air vehicles. Phase 3 includes a realistic, manned-flight environment involving complex human-machine collaboration.
"Our entry into Phase 1 of ACE represents years of relevant research within Dynetics and our team members that position us to do great things for our country," said Kevin Albarado, Dynetics' chief engineer. "Our scientists and engineers are eager to continue advancing these state-of-the-art AI applications to help our warfighters defend our nation."
Dynetics has formed an industry team representing best-in-class leadership to tackle these technological challenges, they include: Soar Technology, Inc. (SoarTech), InfoSciTex, and Intuitive Research & Technology Corporation (IRTC). The Dynetics team will leverage its experience of advancing second and third wave artificial intelligence and autonomy concepts. Many of these concepts are performed within the scope of other major DARPA programs.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Dubai Launches Global Blueprint for Artificial Intelligence
05/02/2024 | BUSINESS WIREDubai has launched a blueprint for Artificial Intelligence (AI), a yearly plan that will focus on harnessing the technology’s potential to improve quality of life around the world.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.