-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Ely Center Development Grant for Aspocomp’s Oulu Plant Investment
June 3, 2020 | GlobeNewswireEstimated reading time: 2 minutes
PCB technology company Aspocomp has been granted a total of EUR 1.35 million in development support by the ELY Center for the implementation of the second phase of its Oulu plant investment. The second phase builds on the investments made in the first phase, which was launched in 2017. The second phase of the investment program aims in particular to increase the capacity of the Oulu plant, improve automation and increase production efficiency. The total investment is approximately EUR 5 million and it strengthens the company's position as a partner to leading technology and semiconductor companies.
The second phase, which is now starting, is part of the EUR 10 million investment program. The first phase was completed in early 2020. The first phase project amounted to approximately EUR 5 million and focused particularly on improving the technological capabilities of printed circuit boards. The goals of the project were successfully achieved: the customer base was strengthened and the planned technological improvements were implemented.
The second phase of the investment program focuses on increasing capacity. All the equipment in the investment will be installed in an existing plant building and no additional plant space will be built. The investment also includes equipment to improve production automation or lead times. The investments will be carried out in the period between 2020 and 2022, mainly in 2021.
High-tech circuit boards are increasingly needed in applications where the speed of the communication components is important. With these investments, the company aims to further strengthen its position as a strategic partner to leading companies in the semiconductor, automotive, defense and aerospace, and telecommunications (5G) industries.
The investment is partly funded with cash flow from business operations and partly with loan financing. The ELY Center announced its decision on granting support to the company on June 1, 2020, according to which the company will receive an investment grant of EUR 1.35 million for the implementation of the project, corresponding to about 25% of its total cost. The development grant received by Aspocomp is part of the Sustainable Growth and Work 2014-2020 – Finnish Structural Funds program. The project belongs to the European Regional Development Fund under the leverage from the EU 2014-2020 program. The development grant will be paid in arrears according to the actual costs of the project.
The investment is expected to increase the number of employees at the Oulu plant. During the project, the number of new jobs is expected to increase by about ten.
Aspocomp’s CEO Mikko Montonen: “We want to stay at the forefront of development as PCB manufacturing evolves. Our business requires continuous investment in production capacity and process development so that we can meet the growing technological needs of our customers. In the long term, these investments are expected to significantly improve our competitiveness and strengthen the cornerstones of our strategy - speed and advanced technology - and our position as a partner to the world's leading technology and semiconductor companies.”
Suggested Items
Moog Announces Acquisition of COTSWORKS
07/07/2025 | BUSINESS WIREMoog Inc., a worldwide designer, manufacturer and systems integrator of high-performance precision motion and fluid controls and control systems, announced the acquisition of COTSWORKS Inc., an aerospace and defense fiber optics transceiver component manufacturer, for a purchase price of $63 million.
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.